XCVU125-2FLVA2104E

The XCVU125-2FLVA2104E is a Virtex® UltraScale™ field programmable gate array (FPGA) IC from AMD, supplied in a 2104-FCBGA package (47.5 × 47.5 mm). It provides a high logic count, large on‑chip memory, and extensive I/O capability for complex digital designs that require significant integration and configurability.

With approximately 1,566,600 logic elements, about 90.7 Mbits of embedded memory and 832 I/O pins, this device targets applications that need dense programmable logic, wide parallel interfaces and substantial embedded RAM within a single surface‑mount package.

Key Features

• Core Architecture Virtex® UltraScale™ FPGA architecture implemented in AMD's XCVU125 device family providing a field-programmable platform for custom digital logic.
• Logic Capacity Approximately 1,566,600 logic elements to implement large-scale, complex designs and parallel datapaths.
• Embedded Memory Approximately 90.7 Mbits of on-chip RAM available for buffers, FIFOs and mapped storage within the FPGA fabric.
• I/O Density 832 I/O pins to support wide external interfaces, multiple parallel buses, and high‑pin-count system connections.
• Power Supply Operates with supply voltages in the range of 922 mV to 979 mV, suitable for regulated FPGA core voltage domains.
• Package & Mounting 2104-FCBGA (47.5 × 47.5 mm) package in a surface-mount format for high‑density board integration.
• Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for a variety of commercial and higher-temperature environments.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Custom Digital Acceleration Use the large logic element count and on‑chip RAM to implement custom datapath acceleration and algorithm offload.
• High‑Density I/O Systems 832 I/O pins enable integration with multiple high‑pin-count peripherals and parallel interfaces on a single FPGA.
• Memory‑Intensive Logic Approximately 90.7 Mbits of embedded memory support deep buffering, packet processing and large on‑chip data structures.
• Complex System Integration The 2104-FCBGA package and surface mount form factor allow compact placement of extensive programmable logic in system boards.

Unique Advantages

• Highly Integrated Logic Capacity: Around 1,566,600 logic elements reduce the need for multiple devices by consolidating complex functions into one FPGA.
• Substantial On‑Chip Memory: Approximately 90.7 Mbits of embedded RAM enable large internal buffers and reduce external memory dependency.
• Extensive I/O Count: 832 I/O pins support broad connectivity and parallel interface implementations without additional I/O expanders.
• Compact, High‑Density Package: The 2104-FCBGA (47.5 × 47.5 mm) package offers a high pin count in a single surface-mount footprint for space-constrained boards.
• Controlled Core Voltage Range: A defined supply window of 922 mV to 979 mV supports stable FPGA core operation in regulated power architectures.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation for applications that require higher ambient tolerances than standard commercial devices.

Why Choose XCVU125-2FLVA2104E?

The XCVU125-2FLVA2104E positions itself as a high‑capacity, highly configurable solution for system designs that demand large amounts of programmable logic, extensive embedded memory and broad I/O connectivity in a single device. Its Virtex® UltraScale™ architecture and 2104-FCBGA packaging make it suitable for consolidating complex digital functions and reducing overall system component count.

This device is appropriate for engineering teams and procurement organizations building advanced digital systems that require scalability, integration and a clear specification set — including logic element count, embedded memory, I/O capacity, package dimensions, supply voltage range and operating temperature.

Request a quote to check pricing and availability for the XCVU125-2FLVA2104E or to begin your procurement process.