XCVU13P-1FHGA2104E

The XCVU13P-1FHGA2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, delivering very large programmable logic and embedded memory capacity in a ball-grid array package. It combines substantial logic resources, high on-chip memory, and a large I/O count to support complex, memory‑intensive programmable designs.

With 3,780,000 logic elements, approximately 514.9 Mbits of embedded memory and 832 I/O pins in a 2104-FCBGA (52.5×52.5 mm) package, this device targets applications that require high logic density, significant buffering/working memory, and broad external interfacing while meeting extended-grade temperature and RoHS compliance.

Key Features

• Core Capacity  3,780,000 logic elements for implementing large and parallel custom logic designs.
• Embedded Memory  Approximately 514.9 Mbits of on-chip RAM for buffering, packet storage, and memory‑intensive algorithms.
• High I/O Count  832 user I/O pins to support extensive external connectivity and multi-channel interfacing.
• Package and Mounting  2104-FCBGA supplier device package (52.5×52.5 mm) / 2104-BBGA package case; surface-mount mounting type.
• Power  Core voltage supply range of 825 mV to 876 mV to inform power-rail design and sequencing.
• Operating Range and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic systems  Implement large-scale custom datapaths and control logic using the device's 3,780,000 logic elements and substantial on-chip memory.
• Memory‑intensive processing  Use the approximately 514.9 Mbits of embedded RAM for buffering, queuing, and intermediate storage in complex processing pipelines.
• Multi-channel I/O and interface hubs  Leverage 832 I/O pins for high‑pin‑count interfacing to sensors, transceivers, and external peripherals.

Unique Advantages

• High logic and memory integration: Large counts of logic elements and embedded RAM reduce the need for external FPGA resources and simplify system partitioning.
• Extensive I/O capacity: 832 I/O pins enable dense external connectivity and multi-channel designs without immediate I/O expansion.
• Compact, high‑density package: The 2104-FCBGA (52.5×52.5 mm) package packs high capacity into a single surface-mount component for space-constrained boards.
• Controlled core voltage range: Defined 825 mV–876 mV supply window supports precise power-rail planning for stable core operation.
• Extended operating grade: Rated for 0 °C to 100 °C operation to align with many commercial and extended‑temperature system requirements.
• RoHS compliant: Meets RoHS environmental requirements for materials handling and regulatory compliance.

Why Choose XCVU13P-1FHGA2104E?

The XCVU13P-1FHGA2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA suited for designs that demand extensive logic, large embedded memory, and significant I/O in a single package. Its combination of 3,780,000 logic elements, approximately 514.9 Mbits of RAM, and 832 I/O pins delivers the integration necessary to reduce external components and consolidate complex system functions.

Manufactured by AMD and offered in a 2104-FCBGA package with extended-grade temperature support and RoHS compliance, this device is appropriate for development teams and procurement groups building large, memory- and I/O‑intensive programmable systems who require a high-density FPGA solution.

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