XCVU13P-1FLGA2577I

The XCVU13P-1FLGA2577I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD. It delivers very high logic capacity, substantial on-chip memory, and a large I/O count in a 2577-ball FCBGA package for surface-mount applications.

Designed for industrial-grade applications, this device targets designs that require high integration density, significant embedded memory, and a broad I/O complement while operating across a wide temperature and core-voltage range.

Key Features

• Logic Capacity  Approximately 3,780,000 logic elements, providing extensive programmable logic resources for complex designs.
• Embedded Memory  Approximately 515 Mbits of on-chip RAM, enabling large data buffering, intermediate storage, and memory-intensive processing without external memory dependence.
• I/O Integration  448 user I/O pins to support broad interfacing and high pin-count connectivity needs.
• Package  2577-BBGA, FCBGA package (supplier device package: 2577-FCBGA 52.5×52.5 mm) in a surface-mount form factor to suit dense PCB layouts.
• Power Envelope  Specified operating voltage range of 825 mV to 876 mV to match system core supply requirements.
• Thermal and Environmental  Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

• High-density FPGA designs  Use where millions of logic elements and hundreds of Mbits of embedded memory are required to implement large-scale programmable functions.
• Interface and I/O-rich systems  Suitable for designs that need up to 448 I/O pins for extensive external signaling and peripheral connectivity.
• Industrial control and processing  Applicable in industrial environments that require operation across −40 °C to 100 °C and industrial-grade reliability.

Unique Advantages

• Extensive programmable resources: The device’s ~3.78M logic elements enable implementation of large, complex designs without partitioning across multiple FPGAs.
• Large on-chip memory: Approximately 515 Mbits of embedded RAM reduces dependence on external memory and simplifies system BOM and routing.
• High I/O count: 448 I/O pins support multi-channel interfaces and dense connectivity directly from the FPGA.
• Industrial-grade operation: Rated for −40 °C to 100 °C to meet a wide range of operating environments.
• Compact FCBGA package: 2577-FCBGA (52.5×52.5 mm) surface-mount package enables high-density PCB integration while providing the available ball-count for signals and power.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance.

Why Choose XCVU13P-1FLGA2577I?

The XCVU13P-1FLGA2577I combines very high logic density, substantial embedded memory, and a large I/O complement in a robust industrial-grade package. Its specifications align to applications that demand on-chip capacity, dense connectivity, and operation across a wide temperature range.

This FPGA is well suited to designers and teams implementing large-scale programmable systems that benefit from consolidated logic and memory resources in a single device footprint, offering scalability and integration for complex designs.

Request a quote or submit a purchase inquiry to evaluate the XCVU13P-1FLGA2577I for your next high-density, industrial FPGA design.