XCVU13P-3FIGD2104E

The XCVU13P-3FIGD2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC supplied in a 2104-FCBGA package. It delivers very large programmable logic capacity and substantial embedded memory in a surface-mount FCBGA footprint for high-density designs.

Targeted at applications that require significant on-chip resources and extensive I/O, this extended-grade device operates across a 0 °C to 100 °C range and is RoHS compliant. Key electrical and packaging parameters include a core voltage supply range of 873 mV to 927 mV and a 2104-FCBGA (52.5 × 52.5 mm) package case.

Key Features

• Logic Capacity  Approximately 3,780,000 logic elements available to implement large digital designs and complex processing functions.
• Embedded Memory  Approximately 515 Mbits of on-chip RAM to support memory-intensive tasks and buffering needs.
• I/O Resources  676 user I/O pins to interface with dense peripherals, high-speed lanes, and multi-channel systems.
• Package & Mounting  2104-FCBGA package case (2104-BBGA, FCBGA) sized 52.5 × 52.5 mm, designed for surface-mount assembly on high-density boards.
• Power  Core supply range specified from 873 mV to 927 mV to match intended power architectures.
• Temperature & Grade  Extended-grade device rated for operation from 0 °C to 100 °C.
• Compliance  RoHS compliant for materials and manufacturing processes.

Typical Applications

• High-density programmable logic systems  Leverage the large logic element count for complex combinational and sequential designs where on-chip resources are critical.
• Memory-intensive FPGA designs  Use the approximately 515 Mbits of embedded RAM for buffering, large FIFOs, and data processing tasks.
• I/O-rich interface hubs  Support multiple parallel interfaces or high-channel-count systems with 676 available I/O pins.
• Dense board-level integrations  The 2104-FCBGA package supports compact, surface-mount implementation on advanced PCBs.

Unique Advantages

• Large programmable fabric: The device’s approximately 3,780,000 logic elements enable implementation of sizable, complex hardware designs without external logic expansion.
• Substantial on-chip memory: Approximately 515 Mbits of embedded RAM reduce dependence on external memory for many application needs.
• High I/O count: 676 I/O pins provide flexibility for multi-channel and multi-protocol interfacing on a single device.
• Compact FCBGA packaging: 2104-FCBGA (52.5 × 52.5 mm) supports high-density board layouts while maintaining surface-mount assembly compatibility.
• Extended-grade thermal range: Rated for 0 °C to 100 °C operation to meet extended-temperature application requirements.
• RoHS compliant: Conforms to RoHS requirements for environmentally compatible materials and processes.

Why Choose XCVU13P-3FIGD2104E?

The XCVU13P-3FIGD2104E combines very large logic capacity with substantial embedded memory and a high I/O count in a surface-mount 2104-FCBGA package, making it suitable for designs that demand integrated resources and dense interfacing. Its extended-grade temperature rating and RoHS compliance align with applications that require reliable operation across a defined commercial temperature range.

Choose this Virtex® UltraScale+™ FPGA when your design requires significant on-chip logic and memory resources, extensive I/O, and a compact FCBGA form factor for board-level integration.

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