XCVU13P-L2FHGB2104E

The XCVU13P-L2FHGB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, offered in a 2104-FCBGA package. It delivers very high logic and memory capacity in a surface-mount BGA footprint for designs that require substantial on-chip resources and flexible I/O.

Key Features

• Logic Capacity  Approximately 3,780,000 logic elements to implement large, complex FPGA designs.
• Configurable Logic Blocks  216,000 logic blocks to structure and partition logic functions efficiently.
• Embedded Memory  Approximately 514.9 Mbits of on-chip RAM for buffering, large lookup tables, and embedded data storage.
• I/O Resources  832 I/O pins enabling connectivity to multiple high-density interfaces and peripherals.
• Power Supply Range  Core operating voltage range from 698 mV to 876 mV for defined power-domain design and supply planning.
• Package & Mounting  2104-FCBGA package (52.5 × 52.5 mm) in a surface-mount form factor for compact board implementation.
• Temperature & Grade  Extended grade operation from 0 °C to 110 °C, supporting applications that require extended temperature performance.
• RoHS Compliant  Meets RoHS environmental requirements for material compliance.

Typical Applications

• High-density programmable logic systems  Implement large custom logic functions and complex state machines using the device's extensive logic element capacity.
• Memory-intensive designs  Leverage approximately 514.9 Mbits of embedded memory for buffering, packet processing, or large lookup tables.
• I/O-rich platforms  Use the 832 I/O pins to interface with multiple high-bandwidth peripherals or parallel subsystems.

Unique Advantages

• Substantial on-chip resources:  Approximately 3.78 million logic elements and large embedded RAM reduce the need for external devices and simplify board-level design.
• High I/O count:  832 I/Os provide flexibility to connect multiple subsystems without extensive external bridging.
• Compact, high-density package:  2104-FCBGA packaging delivers high integration in a 52.5 × 52.5 mm footprint for space-constrained designs.
• Defined power envelope:  A specified core voltage range (698 mV–876 mV) supports predictable power budgeting and supply design.
• Extended temperature capability:  Rated 0 °C to 110 °C for applications that require operation beyond standard commercial temperature ranges.
• Regulatory compliance:  RoHS compliance supports environmentally conscious product development and procurement.

Why Choose XCVU13P-L2FHGB2104E?

The XCVU13P-L2FHGB2104E combines very large logic and embedded memory capacity with a high I/O count in a single surface-mount FCBGA package, making it suitable for demanding designs that need integration and predictable thermal and power characteristics. Its extended-grade temperature rating and RoHS compliance add practical value for long-lived, environmentally conscious deployments.

This device is well suited to engineers and teams building large, memory- and I/O-intensive FPGA-based systems who need a compact, high-resource programmable solution from a recognized manufacturer.

Request a quote or submit an inquiry to evaluate XCVU13P-L2FHGB2104E for your next design and to get pricing and availability information.