XCVU13P-L2FHGC2104E

The XCVU13P-L2FHGC2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD. It provides very large on-chip logic and embedded memory resources in a 2104-FCBGA package for designs that require substantial programmable capacity and high I/O counts.

With millions of logic elements, hundreds of megabits of embedded RAM and a broad core voltage range, this device is suitable for applications that need dense logic implementation, significant on-chip buffering, and a high number of external interfaces while operating across an extended temperature range.

Key Features

• Architecture Virtex® UltraScale+™ FPGA core architecture by AMD, offering a high-capacity programmable fabric for complex logic implementations.
• Logic Resources Approximately 3,780,000 logic elements to implement large-scale digital logic and custom hardware functions.
• Embedded Memory Approximately 515 Mbits of embedded memory (514,867,200 total RAM bits) to support on-chip buffering, FIFOs and local data storage.
• I/O and Package 416 user I/Os in a 2104-BBGA (FCBGA) package; supplier device package specified as 2104-FCBGA (52.5 × 52.5 mm). Surface-mount package supports compact board-level integration.
• Power Core supply voltage range of 698 mV to 876 mV, enabling precise power provisioning for core logic.
• Temperature and Grade Extended-grade device with an operating temperature range of 0 °C to 110 °C suitable for deployments requiring wider thermal tolerance than commercial-only parts.
• Compliance RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Compute Acceleration Implement custom hardware accelerators and data-path logic where millions of logic elements and substantial on-chip RAM are required.
• High-density Interface Bridging Support systems that require many external interfaces and signal conversions with 416 available I/Os.
• Embedded System Integration Integrate multiple functions on a single device—logic, buffering and I/O—reducing board-level component count.

Unique Advantages

• Massive Logic Capacity: Approximately 3.78 million logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial On-chip Memory: Approximately 515 Mbits of embedded RAM reduces dependence on external memory for high-bandwidth buffering and local storage.
• High I/O Count: 416 I/Os simplify system-level connectivity for multi-channel interfaces and dense board layouts.
• Compact FCBGA Package: 2104-FCBGA (52.5 × 52.5 mm) provides a high-density package footprint for integration into space-conscious designs.
• Extended Temperature Range: Rated 0 °C to 110 °C to support applications requiring broader operating temperature tolerance.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements.

Why Choose XCVU13P-L2FHGC2104E?

The XCVU13P-L2FHGC2104E positions itself for designs that demand large programmable logic capacity, extensive on-chip memory, and a high number of I/Os within a single, surface-mount FCBGA package. Its extended temperature rating and defined core supply range make it suitable where wider thermal tolerance and precise power provisioning are needed.

This AMD Virtex® UltraScale+™ FPGA provides a combination of scale and integration that supports complex digital processing, high-density interface requirements, and consolidated system functions—helping teams reduce board-level complexity while keeping substantial resources locally available on-chip.

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