XCVU160-2FLGB2104E

The XCVU160-2FLGB2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) in a 2104-FCBGA package. It provides very large programmable logic capacity and significant on-chip memory for designs that require high integration of logic and embedded RAM.

This device targets applications requiring high logic density, extensive I/O, and a compact surface-mount BGA package while operating within an extended temperature range and RoHS-compliant manufacturing requirements.

Key Features

• Programmable Logic Capacity  Approximately 2,026,500 logic elements to support large, complex designs and high-density logic integration.
• Embedded Memory  Approximately 131 Mbits of embedded memory for buffering, caching, and on-chip storage of design data.
• I/O Resources  Up to 702 I/O pins to support wide external interfacing and multiple peripheral connections on a single device.
• Power Supply  Nominal supply range is 922 mV to 979 mV, enabling designers to plan power delivery and sequencing to match device requirements.
• Package and Mounting  2104-FCBGA (47.5×47.5 mm) package, surface-mount, suitable for board-level integration where a high pin-count BGA is required.
• Temperature and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for designs targeted at extended-temperature environments.
• Regulatory  RoHS-compliant to support environmentally conscious manufacturing and procurement.

Typical Applications

• High-density programmable logic systems  Used where large quantities of logic and on-chip memory are needed to implement complex digital functions in a single FPGA.
• I/O-intensive designs  Applicable to systems that require up to 702 external connections for sensors, peripherals, or multi-channel interfaces.
• Board-level prototyping and emulation  Well suited for prototype platforms and hardware emulation that demand substantial logic capacity and embedded RAM.

Unique Advantages

• Large logic capacity: The device’s approximately 2,026,500 logic elements enable consolidation of multiple functions into one FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 131 Mbits of embedded memory provide local storage for buffering and data-intensive operations without immediate external memory dependence.
• High I/O count: 702 I/O pins allow flexible external connectivity and reduce the need for additional I/O expanders.
• Compact high-pin package: The 2104-FCBGA (47.5×47.5 mm) package delivers high pin density in a surface-mount form factor for space-constrained PCBs.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet designs requiring broader temperature tolerance than standard commercial-only ranges.
• RoHS compliance: Supports environmentally compliant manufacturing and procurement workflows.

Why Choose XCVU160-2FLGB2104E?

The XCVU160-2FLGB2104E positions itself as a high-density Virtex® UltraScale™ FPGA option offering a combination of large logic capacity, significant embedded memory, and a high I/O count in a single 2104-FCBGA surface-mount package. Its extended temperature grade and RoHS compliance make it suitable for designs that require both performance-oriented resource density and environmentally conscious production.

This FPGA is appropriate for development teams and system designers building complex, logic‑heavy applications or consolidated FPGA-based platforms that benefit from on-chip memory and extensive I/O connectivity. Its specifications support scalable designs and long-term integration into higher‑function systems.

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