XCVU160-2FLGC2104E

The XCVU160-2FLGC2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers a high-density programmable logic resource and substantial on-chip memory in a single device.

This device provides 2,026,500 logic elements, approximately 131 Mbits of embedded memory, and 416 I/O in a 2104-FCBGA (47.5×47.5) surface-mount package. It is specified for a supply voltage range of 922 mV to 979 mV, an operating temperature range of 0 °C to 100 °C, and is graded Extended with RoHS compliance.

Key Features

• Core Logic: 2,026,500 logic elements for complex programmable logic implementations and large-scale designs.
• Embedded Memory: Approximately 131 Mbits of on-chip RAM to support data buffering, on-chip storage, and state retention within designs.
• I/O Capacity: 416 user I/O pins to support extensive peripheral and system interfacing requirements.
• Power Supply Range: Operates with supply voltages from 922 mV to 979 mV, enabling defined power planning for system integration.
• Package & Mounting: 2104-FCBGA (47.5×47.5) package in a surface-mount form factor for high-density board implementations.
• Operating Grade & Temperature: Extended grade with an operating temperature range of 0 °C to 100 °C for a range of commercial and extended-environment applications.
• Environmental Compliance: RoHS compliant to meet regulatory requirements for lead-free assembly.

Unique Advantages

• Large logic capacity: 2,026,500 logic elements enable consolidation of multiple functions into a single FPGA, reducing system-level component count.
• Substantial on-chip memory: Approximately 131 Mbits of embedded RAM supports extensive buffering, packet storage, and working memory without external SRAM.
• High I/O density: 416 I/O pins provide flexibility for connecting to a wide range of peripherals, interfaces, and daughter cards.
• High-density package: 2104-FCBGA (47.5×47.5) offers a compact footprint for board-level space optimization while supporting high pin counts.
• Defined electrical and thermal envelope: Supply voltage range of 922 mV–979 mV and 0 °C–100 °C operating temperature simplify system design and validation.
• Regulatory compliance: RoHS compliant to align with lead-free manufacturing requirements.

Why Choose XCVU160-2FLGC2104E?

The XCVU160-2FLGC2104E is positioned for designs that require substantial programmable logic, significant embedded memory, and a high number of I/O in a single, surface-mount FCBGA package. Its extended-grade specification and defined supply and temperature ranges make it suitable for projects that need a clear electrical and thermal specification without adding external memory and interface components.

Engineers and procurement teams seeking a high-density Virtex® UltraScale™ FPGA with verifiable on-chip resources and RoHS compliance can select this device to consolidate functionality, streamline board routing, and simplify BOMs while maintaining predictable operating parameters.

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