XCVU190-2FLGA2577E

The XCVU190-2FLGA2577E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD provided in a 2577-FCBGA package. It delivers substantial on-chip programmable logic and embedded memory resources for complex, high-density programmable logic designs.

With 2,349,900 logic elements, approximately 151 Mbits of embedded memory, and 448 user I/O, this device targets designs that require extensive logic capacity, large embedded RAM, and significant I/O connectivity while offering extended-grade operation and RoHS compliance.

Key Features

• Core Logic  2,349,900 logic elements providing a large array of programmable resources for complex logic implementations.
• Embedded Memory  Approximately 151 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• I/O Capacity  448 user I/O pins to accommodate wide peripheral connectivity and multi-channel interfaces.
• Package & Mounting  Supplied in a 2577-BBGA/FCBGA package (supplier device package 2577-FCBGA (52.5x52.5)) with surface-mount mounting for board-level integration.
• Power Supply  Specified core voltage supply range from 922 mV to 979 mV to align with system power design constraints.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for applications requiring extended thermal range.
• Environmental Compliance  RoHS compliant to meet lead-free and restricted-substance requirements.

Typical Applications

• High-density programmable logic systems  Suited to designs that require large logic capacity and extensive on-chip RAM for complex bitstream and control logic.
• Data buffering and memory-heavy functions  Embedded memory supports buffering and storage needs within systems that require significant on-chip RAM.
• Multi-channel I/O designs  The 448 I/O pins enable integration with multiple peripherals, sensors, or interface channels on a single device.

Unique Advantages

• Large programmable resource pool: 2,349,900 logic elements provide capacity for complex logic, consolidation of multiple functions, and scalable design implementation.
• Substantial on-chip memory: Approximately 151 Mbits of embedded RAM reduces the need for external memory for many buffering and state-storage tasks.
• High I/O count: 448 I/O pins simplify board-level routing and allow broad peripheral connectivity without splitting functions across multiple devices.
• Compact FCBGA package: 2577-FCBGA packaging with surface-mount mounting supports dense PCB layouts while keeping the device footprint manageable.
• Extended-grade operation and compliance: Extended grade rating with 0 °C to 100 °C operation and RoHS compliance support deployment in environments requiring extended thermal range and regulatory compliance.

Why Choose XCVU190-2FLGA2577E?

The XCVU190-2FLGA2577E combines a very large logic element count, significant embedded memory, and a high I/O count in a single 2577-FCBGA surface-mount package. These attributes make it a fit for designers aiming to consolidate complex functions onto one FPGA while maintaining substantial on-chip RAM and I/O capability.

Its extended-grade temperature range and RoHS compliance contribute to long-term deployment viability, while the specified core voltage range provides clear parameters for power design and integration. This device is appropriate for teams and projects that require scalable programmable logic resources with defined thermal and power characteristics.

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