XCVU190-2FLGB2104E

The XCVU190-2FLGB2104E is a Virtex® UltraScale™ field-programmable gate array designed to provide very high logic capacity and on-chip memory in a 2104-ball FCBGA package. Its architecture targets designs that require large amounts of programmable logic, extensive embedded RAM, and substantial I/O connectivity.

With a combination of 134,280 configurable logic blocks (CLBs), approximately 2,349,900 logic elements, roughly 150.94 Mbits of embedded memory, and 702 I/Os, this device is suited for high-density digital designs where integration and I/O count matter. It is supplied in a 2104-FCBGA (47.5×47.5) surface-mount package and is RoHS compliant.

Key Features

• Core Capacity  Contains 134,280 configurable logic blocks (CLBs) and approximately 2,349,900 logic elements to support large-scale programmable logic implementations.
• Embedded Memory  Approximately 150.94 Mbits of on-chip RAM for buffering, frame storage, and large data structures within the FPGA fabric.
• I/O Density  702 I/Os provide extensive external connectivity for multi-channel interfaces and complex system integration.
• Package & Mounting  Delivered in a 2104-FCBGA package (47.5×47.5 mm) with surface-mount mounting for compact board integration.
• Power Supply Range  Core voltage support indicated at 922 mV to 979 mV to match platform power planning and regulation requirements.
• Operating Conditions  Extended-grade device specified for an operating temperature range of 0 °C to 100 °C.
• Regulatory  RoHS compliant for material and environmental conformity.

Typical Applications

• High-performance data processing  Large logic and memory resources enable implementation of complex data-paths, pipelines, and real-time processing blocks.
• Network and telecom systems  High I/O count and on-chip memory support multi-channel interfacing and packet buffering for communications equipment.
• Hardware acceleration and prototyping  Extensive logic capacity and RAM make the device suitable for prototyping ASIC functions or accelerating compute workloads in hardware.

Unique Advantages

• High logic and memory density: The combination of 134,280 CLBs, approximately 2,349,900 logic elements, and ~150.94 Mbits of embedded RAM reduces the need for external components.
• Extensive external connectivity: 702 I/Os accommodate multi-channel interfaces and complex system-edge requirements without resorting to external multiplexing.
• Compact FCBGA packaging: 2104-FCBGA (47.5×47.5 mm) provides a dense, surface-mount footprint for space-constrained PCBs.
• Manageable power specification: Core voltage range of 922 mV to 979 mV supports targeted power-regulation planning for system designers.
• Extended operating range: Specified for 0 °C to 100 °C operation to suit applications needing broader-than-commercial thermal capabilities.
• RoHS compliance: Material compliance simplifies integration into products with regulatory material requirements.

Why Choose XCVU190-2FLGB2104E?

The XCVU190-2FLGB2104E positions itself as a highly integrated FPGA option for designs that demand substantial programmable logic, abundant on-chip memory, and a high pin count. Its combination of CLBs, logic elements, embedded RAM and 702 I/Os makes it a practical choice for engineers building large-scale digital systems, high-throughput interfaces, or hardware-accelerated subsystems.

This device offers designers a balance of integration and density in a standardized 2104-FCBGA package with defined power and thermal parameters, enabling predictable board-level decisions and scalability for complex, memory- and logic-intensive applications.

Request a quote or submit an inquiry today to obtain pricing and availability for XCVU190-2FLGB2104E.