XCVU190-3FLGB2104E

The XCVU190-3FLGB2104E is a Virtex® UltraScale™ field programmable gate array from AMD providing very large programmable logic capacity and substantial on-chip memory. Built as a surface-mount 2104-FCBGA device, it targets designs that require extensive logic resources, high I/O density and significant embedded RAM for buffering and algorithm implementation.

With 2,349,900 logic elements, approximately 151 Mbits of embedded memory and 702 I/O, this device is positioned for complex, high-capacity programmable designs where integration and channel density matter.

Key Features

• Core Logic 2,349,900 logic elements provide extensive resources for large FPGA designs and complex algorithm implementation.
• Embedded Memory Approximately 151 Mbits of on-chip RAM support large buffers, frame storage and data-path requirements.
• I/O Density 702 I/O pins enable dense interfacing to peripherals, transceivers and multi-channel systems.
• Package & Mounting 2104-FCBGA package (2104-BBGA, FCBGA) with supplier device package dimension 47.5 × 47.5 mm, surface-mount construction for board-level integration.
• Power Specified core voltage supply range of 970 mV to 1.03 V for core rail planning and power delivery design.
• Operating Temperature & Grade Extended grade device rated for 0 °C to 100 °C operating temperature.
• RoHS Compliance Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• High-density programmable logic systems — Use the device’s 2,349,900 logic elements and extensive embedded memory to consolidate complex logic into a single FPGA for space- and board-count-sensitive designs.
• Multi-channel I/O platforms — 702 I/O pins enable dense connectivity for systems requiring many parallel interfaces, data links or sensor channels.
• Data buffering and packet processing — Approximately 151 Mbits of on-chip RAM provide capacity for frame buffering, packet queues and intermediate data storage in real-time processing pipelines.
• Prototyping and large-scale emulation — The combination of logic capacity and memory makes the device suitable for large prototype designs and hardware emulation tasks.

Unique Advantages

• Extensive logic resources: 2,349,900 logic elements allow implementation of large, monolithic designs without partitioning across multiple FPGAs.
• Substantial on-chip memory: Approximately 151 Mbits of embedded RAM reduce external memory dependencies and simplify data-path design.
• High I/O count: 702 I/O support dense peripheral connectivity and multi-lane interfaces directly from the FPGA package.
• Compact FCBGA package: 2104-FCBGA (47.5 × 47.5 mm) enables high-density board layouts while maintaining surface-mount assembly compatibility.
• Defined supply and thermal envelope: Specified core voltage range (970 mV to 1.03 V) and extended operating temperature (0 °C to 100 °C) support predictable power and thermal planning.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance in manufactured assemblies.

Why Choose XCVU190-3FLGB2104E?

The XCVU190-3FLGB2104E delivers a combination of very large logic capacity, ample embedded memory and high I/O density in a single 2104-FCBGA surface-mount package. It is suited to engineers and design teams consolidating complex digital logic, multi-channel interfaces and significant buffering needs into a single FPGA solution.

As an AMD Virtex® UltraScale™ device, it is intended for designs where integration, predictable power requirements and extended operating range are important considerations for long-term platform scalability and deployment.

Request a quote for the XCVU190-3FLGB2104E to evaluate availability and pricing for your next high-capacity FPGA design. Submit a quote request or contact sales to begin the procurement process.