XCVU19P-1FSVB3824E

The XCVU19P-1FSVB3824E is a Virtex® UltraScale+™ field programmable gate array (FPGA) optimized for designs that require very large logic capacity, significant embedded memory, and high I/O counts. Packaged in a 3824-FCBGA (65×65) form factor and offered in an extended grade, this device targets complex digital systems that need dense programmable logic and broad connectivity.

Key Features

• Logic Capacity  Provides 8,937,600 logic elements suitable for extremely large-scale programmable logic implementations.
• Embedded Memory  Contains 61,236,838 bits of on-chip RAM (approximately 61.24 Mbits) for buffering, caching, and state storage within designs.
• High I/O Count  Offers 2,072 user I/O pins to support extensive external interfaces and parallel connectivity.
• Package and Mounting  Delivered in a 3824-BBGA / 3824-FCBGA (65×65) package and intended for surface-mount assembly to simplify PCB integration of high-pin-count systems.
• Power Supply Range  Operates from a core supply voltage range of 825 mV to 876 mV, enabling integration with precise low-voltage power domains.
• Operating Temperature  Rated for operation from 0 °C to 100 °C, suitable for applications within this ambient range.
• Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements for many markets.
• Grade  Extended grade device for applications that require broader qualification than standard commercial grades.

Typical Applications

• High-density logic systems  Use where multi-million-element programmable logic is required to implement large custom digital functions and algorithms.
• Data buffering and memory-intensive designs  Leverage the approximately 61.24 Mbits of embedded memory for on-chip storage, packet buffering, and temporary data retention.
• Multi-interface connectivity  Deploy in systems that need large numbers of external interfaces or parallel channel support, taking advantage of 2,072 I/O pins.

Unique Advantages

• Massive logic scale: 8,937,600 logic elements enable consolidation of multiple functions into a single programmable device, reducing overall system BOM.
• Substantial on-chip memory: Approximately 61.24 Mbits of embedded RAM reduce dependency on external memory and lower latency for data-intensive tasks.
• Extensive external connectivity: 2,072 I/O pins provide flexibility for interfacing with many peripherals, sensors, or parallel channels without external expander chips.
• Compact high-pin-count package: 3824-FCBGA (65×65) delivers high integration density in a surface-mount form factor suitable for compact PCBs.
• Extended grade and RoHS compliance: Extended grade qualification and RoHS compliance support deployments requiring broader environmental tolerance and lead-free assembly.
• Controlled core voltage range: Operation between 825 mV and 876 mV aligns the device with precise low-voltage power rails used in modern digital systems.

Why Choose XCVU19P-1FSVB3824E?

The XCVU19P-1FSVB3824E positions itself as a high-capacity FPGA option for designs that demand very large programmable logic resources, significant embedded memory, and a large number of external interfaces. Its 3824-FCBGA package and surface-mount mounting simplify board-level integration for space-constrained, high-pin-count applications.

This part is well suited for teams and projects that require scalable logic and memory within a single device while maintaining RoHS compliance and extended-grade qualification. The combination of core voltage specification, operating temperature range, and package density provides a clear foundation for robust, long-lived designs.

Request a quote or submit your project requirements to receive pricing and availability for the XCVU19P-1FSVB3824E. Our team can provide configuration guidance and support to help evaluate this device for your design.