XCVU23P-1FSVJ1760E

The XCVU23P-1FSVJ1760E is a Virtex® UltraScale+™ field programmable gate array (FPGA) integrated circuit from AMD. It provides a high count of programmable logic resources, significant on‑chip RAM capacity, and a large I/O complement in a 1760‑ball FCBGA package suited for surface‑mount placement.

This device is intended for designs that require substantial logic capacity, considerable embedded memory, and a wide array of I/O while operating within a supply range of 0.825 V to 0.876 V and an ambient temperature range of 0 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 2,252,250 logic elements to support high-density digital designs and complex programmable logic implementations.
• Configurable Logic Blocks  A large number of configurable logic resources (reported count included in product data) to structure complex logic hierarchies.
• Embedded Memory  Approximately 78 Mbits of on‑chip RAM (77,909,197 bits) for buffering, lookup tables, and state storage without external memory.
• I/O Count and Package  644 I/O pins in a 1760‑FBG A FCBGA package (42.5 × 42.5 mm) for extensive external interfacing and compact board integration.
• Power Supply  Operates from a supply range of 0.825 V to 0.876 V to match targeted core power rails.
• Thermal and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C, and RoHS compliance for environmental requirements.
• Mounting  Surface mount package case (1760‑BBGA / 1760‑FCBGA) for standard PCB assembly processes.

Typical Applications

• High‑density digital systems  Utilize the large logic element count to implement complex state machines, custom datapaths, and deep combinational logic.
• On‑chip buffering and storage  Leverage approximately 78 Mbits of embedded RAM for frame buffering, packet buffering, and intermediate data storage without immediate external memory.
• Multi‑I/O interfacing  The 644 I/O pins support designs requiring numerous external interfaces or parallel connection arrays in a single device.

Unique Advantages

• High logic density: 2,252,250 logic elements enable consolidation of complex functions into a single FPGA, reducing system BOM complexity.
• Significant embedded memory: Approximately 78 Mbits of on‑chip RAM minimize dependence on external memory for many buffering and storage needs.
• Broad I/O complement: 644 I/Os provide flexibility for interfacing with multiple peripherals, sensors, or parallel data streams.
• Compact FCBGA footprint: The 1760‑FCBGA (42.5 × 42.5 mm) package balances high pin count with a manageable PCB area for dense board layouts.
• Defined power and thermal window: Clear supply range (0.825–0.876 V) and operating temperature (0 °C–100 °C) simplify power budgeting and thermal planning.
• Regulatory compliance: RoHS‑compliant construction supports environmental and manufacturing requirements.

Why Choose XCVU23P-1FSVJ1760E?

The XCVU23P-1FSVJ1760E positions itself as a high‑capacity Virtex® UltraScale+™ FPGA option from AMD, combining millions of logic elements with substantial embedded RAM and a large I/O count in a 1760‑ball FCBGA package. Its defined supply and operating temperature range and RoHS compliance make it suitable for designs that need dense programmable logic resources with predictable power and thermal characteristics.

This device is well suited to engineers and teams developing complex digital systems that require on‑chip memory, many external interfaces, and the ability to integrate multiple functions into a single FPGA footprint—helping reduce board‑level component count and simplify system architecture.

Request a quote or submit an inquiry to receive pricing and availability information for the XCVU23P-1FSVJ1760E. Include your required quantity and target delivery timeframe for a faster response.