XCVU23P-1VSVA1365I

The XCVU23P-1VSVA1365I is a Virtex® UltraScale+™ FPGA IC from AMD, delivered in a 1365-FCBGA package. It provides very high logic capacity and embedded memory suitable for designs that require extensive programmable logic and on-chip RAM.

With industrial-grade qualification, a wide operating temperature range and a low core voltage supply window, this device targets applications where high integration, dense I/O and robust thermal tolerance are required.

Key Features

• Core Logic  Contains 128,700 configurable logic blocks (CLBs) and 2,252,250 logic elements, enabling very large-scale programmable logic implementations.
• Embedded Memory  Approximately 77.9 Mbits of on-chip RAM to support large buffering, lookup tables and data storage close to logic.
• I/O  364 user I/O pins to support high-density external connectivity and interface flexibility.
• Power  Core voltage supply range of 825 mV to 876 mV for the device core power domain.
• Package & Mounting  1365-BFBGA / 1365-FCBGA package (supplier device package noted as 1365-FCBGA (35×35)), surface-mount construction for board-level integration.
• Thermal & Reliability  Industrial grade with an operating temperature range from −40 °C to 100 °C for use in demanding environments.
• Compliance  RoHS compliant to support environmentally conscious designs.

Unique Advantages

• Extremely high logic density: 2,252,250 logic elements enable consolidation of large FPGA designs onto a single device, reducing the need for multi-FPGA partitioning.
• Significant on-chip memory: Approximately 77.9 Mbits of embedded RAM allows large data buffers and fast local storage, improving data flow and latency.
• High I/O count: 364 I/O pins provide flexibility for connecting multiple peripherals, interfaces and high-speed lanes without external multiplexing.
• Industrial-grade operation: Rated for −40 °C to 100 °C, suited to environments that require extended temperature tolerance.
• Compact surface-mount package: 1365-FCBGA (35×35) package allows integration into dense PCB layouts while supporting the device’s high pin count.
• RoHS compliance: Environmentally compliant manufacturing and disposal considerations are supported out of the box.

Why Choose XCVU23P-1VSVA1365I?

The XCVU23P-1VSVA1365I positions itself as a high-capacity, industrial-grade FPGA option delivering substantial programmable logic, abundant embedded memory and a large I/O complement in a single 1365-FCBGA package. Its characteristics make it well suited for designs that require on-chip scale, thermal resilience and a compact board footprint.

For teams building large, integration-heavy FPGA designs, this device offers scalability and long-term value through consolidated logic capacity, significant on-chip RAM and compliance attributes that simplify product qualification and environmental considerations.

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