XCVU23P-2VSVA1365I

The XCVU23P-2VSVA1365I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-density programmable logic fabric with on-chip embedded memory and a substantial I/O count, delivered in a 1365-pin FCBGA package.

This industrial-grade device is specified for a core supply range of 0.825 V to 0.876 V and an operating temperature range of −40 °C to 100 °C, supporting designs that require large logic capacity and robust thermal performance.

Key Features

• Programmable Logic Density  128,700 CLBs and 2,252,250 logic elements provide extensive capacity for complex, high-density designs.
• Embedded Memory  Approximately 78 Mbits of on-chip RAM (77,909,197 total RAM bits) for buffering, lookup tables, and data storage inside the FPGA fabric.
• I/O Capacity  364 user I/O pins to support a wide range of peripheral interfaces and board-level connections.
• Power Supply  Core voltage supply specified from 0.825 V to 0.876 V for the device core.
• Package & Mounting  1365-BFBGA FCBGA package; supplier device package listed as 1365-FCBGA (35×35). Surface-mount mounting type for PCB assembly.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High logic capacity: The combination of 128,700 CLBs and 2,252,250 logic elements enables implementation of large-scale programmable designs without external logic expansion.
• Substantial on-chip memory: Approximately 78 Mbits of embedded RAM reduces dependence on external memory for many data buffering and processing tasks.
• Ample I/O count: 364 I/O pins facilitate integration with multiple high-speed interfaces and board-level peripherals.
• Industrial temperature rating: Specified −40 °C to 100 °C operation supports deployments in demanding thermal environments.
• Compact, high-pin-count package: 1365-pin FCBGA (35×35) package supports dense board layouts while providing the necessary I/O and power pins.
• RoHS compliant: Meets common environmental requirements for lead-free production.

Why Choose XCVU23P-2VSVA1365I?

The XCVU23P-2VSVA1365I positions itself as a high-density, industrial-grade FPGA solution within the Virtex® UltraScale+™ family. With over two million logic elements, approximately 78 Mbits of embedded RAM, and 364 I/Os in a 1365-FCBGA package, it provides the integration and capacity needed for complex programmable logic implementations where on-chip resources and robust operating range are required.

This device is suitable for teams and projects that need scalable logic and memory capacity in an industrial-temperature-rated FPGA, backed by the Virtex UltraScale+ architecture and AMD product lineage. Its package and mounting options support conventional surface-mount assembly and dense PCB designs, helping to simplify system-level integration.

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