XCVU23P-3FSVJ1760E

The XCVU23P-3FSVJ1760E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, delivered in a 1760-ball FCBGA surface-mount package. It combines very large programmable logic capacity with substantial on-chip memory and high I/O count for complex digital system designs.

Key device attributes include 2,252,250 logic elements, approximately 78 Mbits of embedded memory, 644 I/O pins, an extended grade temperature range of 0 °C to 100 °C, and a supplier device package dimension of 1760-FCBGA (42.5 × 42.5 mm). The device core supply range is specified from 873 mV to 927 mV.

Key Features

• Logic Capacity  2,252,250 logic elements to support large-scale digital designs and dense logic implementations.
• Embedded Memory  Approximately 78 Mbits of on-chip RAM for buffering, data storage, and high‑performance memory needs.
• I/O Connectivity  Up to 644 I/O pins enabling broad external interfacing and high channel count connectivity.
• Package and Mounting  1760-BBGA (FCBGA) surface-mount package; supplier device package specified as 1760-FCBGA (42.5 × 42.5 mm) for compact high-density board designs.
• Power and Voltage  Core supply range defined between 873 mV and 927 mV for predictable power planning and regulator selection.
• Temperature Grade  Extended grade operation from 0 °C to 100 °C for deployment in environments within this range.
• RoHS Compliant  Manufactured in accordance with RoHS requirements.

Unique Advantages

• High logic density: The device's 2,252,250 logic elements deliver capacity for complex algorithms and large-scale FPGA implementations without external logic expansion.
• Substantial on-chip memory: Approximately 78 Mbits of embedded RAM reduce reliance on external memory, simplifying board layout and improving latency for data-intensive tasks.
• Extensive external interfacing: 644 I/O pins provide the channel count needed for multiport designs, high-speed interfaces, and large sensor or peripheral arrays.
• Compact high-density package: 1760-FCBGA (42.5 × 42.5 mm) enables placement of a powerful FPGA in space-constrained designs while maintaining a surface-mount form factor.
• Predictable power envelope: A defined core voltage range of 873–927 mV assists in accurate power-supply design and thermal planning.
• Extended operating range: Rated for 0 °C to 100 °C operation to support designs targeted at a wide set of controlled-environment applications.

Why Choose XCVU23P-3FSVJ1760E?

The XCVU23P-3FSVJ1760E positions itself as a high-capacity FPGA option for designs that require a large number of logic elements, ample on-chip memory, and significant I/O resources in a single surface-mount package. Its extended temperature grade and defined core voltage range help simplify system-level power and thermal considerations.

This device is suited to engineering teams building dense digital systems that need scalability of logic and memory within a compact FCBGA footprint. Choosing this part provides a clear path to integrate substantial programmable logic and memory resources directly on-chip, reducing board complexity and supporting robust design architectures.

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