XCVU23P-2FSVJ1760E

The XCVU23P-2FSVJ1760E is a Virtex® UltraScale+™ FPGA from AMD, offered in a 1760-ball FCBGA package. It provides very large logic capacity, substantial embedded memory, and a high I/O count for complex, integration-dense designs.

Key device attributes visible in the specification set include 2,252,250 logic elements, approximately 78 Mbits of on-chip RAM, 644 I/O, an extended grade operating range of 0 °C to 100 °C, and a supply voltage window of 825 mV to 876 mV.

Key Features

• Logic Capacity — 2,252,250 logic elements and 128,700 logic blocks provide the raw capacity needed for large-scale hardware implementations and complex algorithms.
• Embedded Memory — Approximately 78 Mbits of on‑chip RAM supports large buffering, FIFOs, and memory-intensive functions without relying solely on external memory.
• High I/O Count — 644 user I/O pins accommodate wide parallel interfaces, multiple high‑speed links, and rich peripheral connectivity.
• Power Supply Range — Core supply specified from 825 mV to 876 mV, enabling designs that target this voltage window for device operation.
• Package and Mounting — 1760-FCBGA (42.5 × 42.5 mm) surface-mount package provides a compact footprint for board-level integration while delivering high pin density.
• Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for applications within this thermal envelope.
• Environmental Compliance — RoHS compliant, meeting common lead-free and hazardous substance requirements.

Typical Applications

• High-density logic designs — Implements large, complex logic networks and compute pipelines that require millions of logic elements.
• Memory-intensive functions — Uses the device’s ~78 Mbits of embedded RAM for buffering, packet queues, and on-chip data processing.
• I/O-rich interfaces — Supports boards and systems that need hundreds of user I/O for parallel buses, wide-channel I/O, or numerous peripheral connections.
• Platform and prototype development — Suitable for FPGA-based platform builds where significant logic, memory, and I/O resources are required on a single device.

Unique Advantages

• Substantial on-chip resources: Over two million logic elements and ~78 Mbits of embedded RAM reduce dependence on external logic and memory, simplifying BOM and board routing.
• High connectivity: 644 I/O pins accommodate complex interface requirements without needing multiple FPGAs for I/O expansion.
• Compact, high-density package: The 1760-FCBGA (42.5 × 42.5 mm) delivers a high pin-count solution in a single-device footprint for space-constrained systems.
• Clear thermal and power parameters: Documented operating range of 0 °C to 100 °C and a defined core supply window (825 mV–876 mV) aid power budgeting and thermal planning.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements for lead-free production.

Why Choose XCVU23P-2FSVJ1760E?

This Virtex® UltraScale+™ FPGA is positioned for designs that require a combination of very large logic capacity, significant embedded memory, and high I/O density in a single, manufacturable package. The detailed electrical and thermal parameters included in the specification support predictable power, thermal, and board-level design choices.

Choose the XCVU23P-2FSVJ1760E when your design needs to consolidate complex functions onto a single FPGA device while maintaining clear constraints for supply voltage, operating temperature, and package integration.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability information for the XCVU23P-2FSVJ1760E.