XCVU23P-1FSVJ1760I

The XCVU23P-1FSVJ1760I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, provided in a 1760-FCBGA package. It combines large programmable logic resources, substantial on-chip memory, and a high I/O count for designs that require significant compute and interfacing capability.

With 2,252,250 logic elements, approximately 77.9 Mbits of embedded memory and 644 I/O, this device targets applications that need dense logic capacity, large embedded memory, and broad external connectivity, while operating across an industrial temperature range.

Key Features

• Logic Resources  2,252,250 logic elements and 128,700 configurable logic blocks (CLBs) provide extensive programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 77.9 Mbits of on-chip RAM to support buffering, large lookup tables, and memory-intensive algorithms.
• High I/O Count  644 I/O pins accommodate wide parallel interfaces, multiple high-speed links, and dense sensor or peripheral connectivity.
• Power Supply Range  Core voltage operation specified between 825 mV and 876 mV to match system power budgets and regulator designs.
• Package & Mounting  1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for compact PCB integration; package case listed as 1760-BBGA, FCBGA.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-variable environments.
• Regulatory Status  RoHS compliant to support modern environmental and manufacturing requirements.

Typical Applications

• Data and Compute Acceleration  Implement custom accelerators and offload engines that require large logic arrays and embedded memory.
• Signal and Image Processing  Process high-throughput DSP workloads using extensive logic resources and on-chip RAM for buffering and algorithm state.
• Protocol Bridging and I/O Aggregation  Support complex interfacing tasks and multi-protocol designs with a high I/O count and flexible packaging.

Unique Advantages

• Large Programmable Fabric  2,252,250 logic elements enable implementation of sizable custom logic blocks and complex control datapaths on a single device.
• Significant On-Chip Memory  Approximately 77.9 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O Capacity  644 I/O pins allow dense peripheral connectivity and support for wide parallel interfaces without additional glue logic.
• Industrial Temperature Range  Rated from −40 °C to 100 °C for reliable operation in temperature-challenging deployments.
• Compact FCBGA Packaging  1760-FCBGA (42.5 × 42.5 mm) surface-mount package balances density and board-level integration for space-constrained designs.
• Manufacturer Backing  Produced by AMD, ensuring alignment with documented product support and design resources.

Why Choose XCVU23P-1FSVJ1760I?

The XCVU23P-1FSVJ1760I positions itself as a high-capacity Virtex UltraScale+ FPGA option for designs that require a large programmable fabric, substantial embedded memory, and a high number of I/Os in a single, industrial-grade package. Its combination of 2.25 million logic elements, approximately 77.9 Mbits of on-chip RAM, and 644 I/O pins makes it suitable for complex compute, signal processing, and dense interfacing tasks.

Engineers and system designers seeking a scalable, AMD-supported FPGA platform for demanding embedded or compute-accelerated applications can leverage this device to consolidate functionality, reduce external components, and meet industrial temperature requirements.

Request a quote or submit a procurement inquiry to evaluate XCVU23P-1FSVJ1760I for your next design.