XCVU19P-2FSVB3824E

The XCVU19P-2FSVB3824E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD offered in a 3824-FCBGA surface-mount package. It combines very large programmable logic capacity and significant embedded memory with high I/O density for complex digital designs.

This device provides 8,937,600 logic elements, approximately 79.6 Mbits of embedded memory, and 1,760 I/O pins. Key electrical and environmental data include a supply range of 825 mV to 876 mV, an operating temperature range of 0 °C to 100 °C, extended-grade qualification, and RoHS compliance.

Key Features

• Logic Capacity 8,937,600 logic elements and 510,720 configurable logic blocks to support large-scale programmable designs.
• Embedded Memory Approximately 79.6 Mbits of on-chip RAM for buffering, state storage, and local data handling.
• I/O Density 1,760 I/O pins to support wide external connectivity and multiple parallel interfaces.
• Package & Mounting 3824-FCBGA (65×65) package in a surface-mount form factor for high pin-count, high-density board designs.
• Power Dedicated supply range of 825 mV to 876 mV to guide power-domain design and sequencing.
• Temperature & Grade Extended-grade device rated for operation from 0 °C to 100 °C.
• Compliance RoHS-compliant for environmental and regulatory considerations.

Typical Applications

• High-density FPGA designs — For projects that require very large programmable logic capacity and extensive on-chip memory to implement complex algorithms or large custom compute fabrics.
• High I/O systems — For systems that need broad external connectivity and parallel interfaces, leveraging the device’s 1,760 I/O pins.
• System prototyping and integration — For platform development where a high-pin-count, surface-mount FCBGA package simplifies board-level integration and reduces multi-chip solutions.

Unique Advantages

• Massive programmable logic: 8,937,600 logic elements reduce the need for multiple devices and enable large, consolidated designs.
• Significant embedded memory: Approximately 79.6 Mbits of on-chip RAM provide local storage for buffering, state machines, and data processing.
• Very high I/O count: 1,760 I/O pins simplify external interface design and support dense connectivity requirements.
• Compact, high-pin package: 3824-FCBGA (65×65) surface-mount package enables a compact board footprint while maintaining high signal density.
• Defined power window: 825 mV to 876 mV supply range assists in precise power delivery and design planning.
• Extended operating range: 0 °C to 100 °C rating for applications within that environmental envelope.

Why Choose XCVU19P-2FSVB3824E?

The XCVU19P-2FSVB3824E positions itself as a high-capacity, high-connectivity FPGA suitable for designs that demand extensive programmable logic, substantial on-chip memory, and a large number of I/O. Its 3824-FCBGA surface-mount package and extended-grade rating make it appropriate for complex system-level integrations where board area and signal density are critical.

Choose this device when your project requires consolidating large functions into a single FPGA, maintaining dense external interfacing, and designing within the specified power and temperature ranges. The combination of logic capacity, memory, and I/O provides a scalable platform for advanced digital designs.

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