XCVU19P-2FSVA3824E

The XCVU19P-2FSVA3824E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 3824-FCBGA package. It combines very high logic capacity, extensive on-chip memory, and a large I/O count for designs that demand dense programmable logic and significant embedded memory resources.

This device targets applications that require high logic density, large embedded RAM, and substantial I/O connectivity while operating within an 0 °C to 100 °C range and a defined core voltage window.

Key Features

• Core Logic Approximately 8,937,600 logic elements for highly parallel and complex programmable logic implementations.
• Embedded Memory Approximately 79.6 Mbits of on-chip RAM to support large buffering, local storage, and memory-intensive algorithms.
• I/O Capacity 1,976 user I/O pins to support dense peripheral interfaces, multi-channel data aggregation, and high-bandwidth connectivity.
• Power Supply Supported core voltage range of 825 mV to 876 mV for defined power-domain design and verification.
• Package 3824-FCBGA (65×65) package providing a compact, high-pin-count footprint for system integration.
• Thermal and Grade Operating temperature range 0 °C to 100 °C and Extended grade marking for deployment within that specified range.
• Standards Compliance RoHS compliant.

Typical Applications

• High-density digital processing — Use the device’s large logic capacity and embedded RAM to implement complex datapath and algorithm acceleration tasks.
• Multi-channel I/O aggregation — Leverage nearly 2,000 I/O pins to consolidate and route high-channel-count interfaces on a single FPGA.
• On-board system integration — Integrate large amounts of programmable logic and memory in a compact 3824-FCBGA package for space-constrained platforms.

Unique Advantages

• High logic density: Approximately 8.94 million logic elements enable substantial parallelism and complex custom logic designs.
• Large on-chip memory: Approximately 79.6 Mbits of embedded RAM reduces dependence on external memory for many applications.
• Extensive connectivity: 1,976 I/O pins support multiple interfaces and high-channel-count systems without immediate need for external I/O expanders.
• Compact high-pin package: 3824-FCBGA (65×65) balances integration density with board-level routing considerations.
• Defined operating window: Core voltage range of 825 mV–876 mV and operating temperature 0 °C–100 °C provide clear electrical and thermal design parameters.
• Regulatory compliance: RoHS compliance for environmental and materials considerations.

Why Choose XCVU19P-2FSVA3824E?

The XCVU19P-2FSVA3824E delivers a combination of very high logic capacity, substantial on-chip RAM, and nearly 2,000 I/O pins in a single 3824-FCBGA package. Its specification set makes it suitable for designs that require dense programmable logic, significant embedded memory, and wide interface support while operating within a defined voltage and temperature range.

Manufactured by AMD and provided in an Extended-grade package, the device is well suited to engineering teams building complex FPGA-based subsystems that prioritize integration density, clear electrical limits, and RoHS compliance.

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