XCVU23P-1VSVA1365E

The XCVU23P-1VSVA1365E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) supplied in a 1365-BFBGA / 1365-FCBGA (35×35) surface-mount package. It provides 2,252,250 logic elements, approximately 78 Mbits of on-chip RAM, and 364 I/O pins, making it suitable for designs that require very high programmable logic capacity and substantial embedded memory.

The device operates with a core voltage supply range of 0.825 V to 0.876 V and is specified for an operating temperature range of 0 °C to 100 °C. It is RoHS compliant and offered in an extended-grade variant.

Key Features

• FPGA Core High-density Virtex UltraScale+ architecture implemented as a field programmable gate array.
• Logic Capacity 2,252,250 logic elements to support large-scale digital designs.
• Embedded Memory Approximately 78 Mbits of on-chip RAM for data buffering, lookup tables, and state storage.
• I/O 364 I/O pins to interface with multiple peripherals and system buses.
• Package 1365-BFBGA / 1365-FCBGA (35×35) supplier device package in a surface-mount format.
• Power Core supply voltage range of 0.825 V to 0.876 V for design integration and power planning.
• Temperature & Grade Extended-grade device rated for 0 °C to 100 °C operating temperature.
• Environmental RoHS compliant.

Typical Applications

• Custom logic and prototyping — Implement complex programmable logic using 2,252,250 logic elements and extensive on-chip RAM for system prototypes and custom digital IP.
• Memory-intensive designs — Leverage approximately 78 Mbits of embedded memory for buffering, look-up tables, and streaming data tasks within the FPGA fabric.
• Multi-interface systems — Use 364 I/O pins to aggregate and control multiple peripherals, sensors, or subsystems.
• High-density embedded systems — Integrate large-scale programmable functionality in a compact 1365-FCBGA surface-mount package.

Unique Advantages

• Large programmable capacity: 2,252,250 logic elements provide the headroom needed for complex, high-density logic implementations.
• Significant on-chip memory: Approximately 78 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Broad I/O availability: 364 I/O pins support extensive system interfacing and flexible signal routing.
• Compact BFBGA package: 1365-FCBGA (35×35) surface-mount package enables high-density board layouts while maintaining a single-package solution.
• Defined operating envelope: Core voltage range (0.825–0.876 V) and 0 °C to 100 °C operating temperature provide clear electrical and thermal limits for system design.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements.

Why Choose XCVU23P-1VSVA1365E?

The XCVU23P-1VSVA1365E delivers substantial programmable logic capacity and embedded memory in a single, surface-mount 1365-FCBGA package, suited to designers needing high-density FPGA resources. Its clear electrical and thermal specifications simplify integration into complex digital systems where on-chip logic and memory density are primary requirements.

This device is appropriate for teams and projects that require scalable programmable logic, sizable embedded RAM, and ample I/O in a RoHS-compliant, extended-grade FPGA offering.

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