XCVU23P-2VSVA1365E

The XCVU23P-2VSVA1365E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC designed to deliver very large on-chip logic and memory capacity in a high-pin-count FCBGA package. Its architecture provides a foundation for designs that require extensive programmable logic, significant embedded RAM, and a substantial I/O complement.

This device is targeted at applications and designs that demand high logic density and abundant embedded memory while maintaining a compact surface-mount package and extended-grade temperature operating range.

Key Features

• Core Logic  128,700 logic elements and 2,252,250 logic cells provide extensive programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 77.9 Mbits of embedded memory available on-chip to support large data buffers, FIFOs, and algorithm state storage.
• I/O Capacity  364 general-purpose I/O pins to support broad connectivity needs and multiple external interfaces.
• Power Supply Range  Core voltage supply specified between 825 mV and 876 mV for compatibility with targeted power domains and system design constraints.
• Package & Mounting  1365-BFBGA (supplier package: 1365-FCBGA, 35×35) in a surface-mount form factor to support automated PCB assembly and dense board layouts.
• Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for deployments requiring elevated ambient tolerance.
• Compliance  RoHS compliant to support designs targeting lead-free manufacturing processes.

Typical Applications

• High-density digital processing  Implement large-scale custom logic functions and complex state machines using the device’s extensive logic resources and embedded RAM.
• Data buffering and memory-intensive tasks  Use the approximately 77.9 Mbits of on-chip RAM for packet buffering, streaming data staging, or intermediate storage in data-path designs.
• Multi‑interface bridging and aggregation  Leverage 364 I/O pins to connect and aggregate multiple external interfaces or to support dense peripheral connectivity.

Unique Advantages

• High logic capacity: 128,700 logic elements and 2,252,250 logic cells enable implementation of large, partitioned logic designs without immediate need for external programmable logic.
• Substantial embedded memory: Approximately 77.9 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs, simplifying BOM and board routing.
• Robust I/O count: 364 I/O pins offer design flexibility for connecting multiple peripherals, interfaces, or parallel data lanes.
• Compact FCBGA package: The 1365-FCBGA (35×35) package supports high-density PCB designs and surface-mount assembly processes.
• Extended operating range: Rated 0 °C to 100 °C and specified core voltage range (825 mV–876 mV) to match system power domains and thermal environments within the extended grade.
• RoHS compliant: Supports lead-free manufacturing workflows and regulatory requirements for many global markets.

Why Choose XCVU23P-2VSVA1365E?

The XCVU23P-2VSVA1365E positions itself as a high-capacity FPGA solution for projects that require a combination of very large programmable logic, significant embedded memory, and a wide complement of I/O in a compact surface-mount FCBGA package. Its extended-grade temperature range and defined core voltage window make it suitable for systems that operate in warmer environments while maintaining precise power requirements.

This device is well suited for engineering teams building designs that need scalable logic and memory resources on a single device, reducing external component count and simplifying board-level integration. Its RoHS compliance and FCBGA package support modern manufacturing and assembly practices, while the large on-chip resources provide long-term headroom for design growth and iteration.

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