XCVU23P-L2FSVJ1760E

The XCVU23P-L2FSVJ1760E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1760-FCBGA package (42.5 × 42.5 mm). It delivers a high-density programmable fabric with a large on-chip memory footprint and extensive I/O resources for complex digital designs.

This device is offered in an extended-grade variant with an operating temperature range of 0 °C to 110 °C and a specified core voltage supply range of 698 mV to 742 mV, intended for designs that require substantial logic capacity and significant embedded memory in a surface-mount FCBGA form factor.

Key Features

• High-density logic — 2,252,250 logic elements to support large-scale programmable designs and complex logic implementations.
• Embedded memory — approximately 78 Mbits of on-chip RAM for buffering, data storage, and state retention within the FPGA fabric.
• Extensive I/O — 644 available I/O pins to interface with a broad range of external devices and high-pin-count systems.
• Package & mounting — supplied in a 1760-FCBGA (1760-BBGA, FCBGA) surface-mount package with a 42.5 × 42.5 mm footprint for board-level integration.
• Power — specified supply range of 698 mV to 742 mV to match targeted core-voltage requirements.
• Temperature & grade — extended grade device rated for 0 °C to 110 °C operating temperature range.
• Compliance — RoHS compliant, supporting environmental and lead-free assembly requirements.

Typical Applications

• High-density digital signal processing — uses the device’s 2,252,250 logic elements and approximately 78 Mbits of embedded memory to implement large parallel processing blocks and buffering.
• Network and communications — leverages 644 I/O pins and substantial on-chip RAM to handle high-port counts and packet buffering in communication infrastructure designs.
• Data acceleration and compute — accommodates complex, compute-heavy pipelines with high logic resource counts and embedded memory for intermediate data storage.

Unique Advantages

• Massive logic capacity: 2,252,250 logic elements provide headroom for complex finite-state machines, datapaths, and custom accelerators.
• Significant on-chip RAM: approximately 78 Mbits of embedded memory reduces dependence on external memory for many buffering and caching use cases.
• High I/O density: 644 I/Os enable direct connectivity to multiple peripherals, high-speed transceivers, or multi-channel interfaces.
• Extended operating range: Rated for 0 °C to 110 °C and marked as Extended grade for applications requiring broader thermal tolerance than commercial-only devices.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) offers a high-pin-count solution in a surface-mount footprint suitable for dense PCB layouts.
• Environmental compliance: RoHS compliance supports lead-free assembly and environmental sourcing requirements.

Why Choose XCVU23P-L2FSVJ1760E?

The XCVU23P-L2FSVJ1760E positions itself for applications requiring large programmable logic capacity paired with substantial embedded memory and high I/O counts. Its extended-grade temperature range and surface-mount 1760-FCBGA package make it suitable for board-level integration where dense logic and on-chip storage are priorities.

As a member of the Virtex® UltraScale+™ family from AMD, this device provides a platform for designers who need scalable logic resources, abundant on-chip RAM, and extensive connectivity, delivering the core capabilities necessary for advanced digital signal processing, communications, and compute-acceleration projects.

Request a quote or submit a pricing inquiry to evaluate the XCVU23P-L2FSVJ1760E for your next high-density FPGA design.