XCVU23P-L2VSVA1365E

The XCVU23P-L2VSVA1365E is a Virtex® UltraScale+™ field programmable gate array (FPGA) from AMD offering very large logic capacity, substantial embedded memory, and a high I/O count in a 1365-FCBGA package. It targets designs that require dense programmable logic and significant on-chip RAM while maintaining a compact surface-mount package.

Key attributes include 2,252,250 logic elements, approximately 78 Mbits of embedded memory, 364 I/O pins, and an extended operating temperature range of 0 °C to 110 °C, making it suitable for demanding electronic systems that need high integration and robust thermal headroom.

Key Features

• Core Logic Capacity  2,252,250 logic elements provide a very high programmable logic resource for complex digital designs and large-scale integration.
• Embedded Memory  Approximately 78 Mbits of on-chip RAM to support large buffers, FIFOs, and data-intensive processing directly on the FPGA fabric.
• I/O Density  364 I/O pins accommodate wide parallel interfaces, multiple channel connectivity, and flexible system-level routing.
• Power Supply Range  Operational core voltage range of 698 mV to 742 mV, suitable for designs that follow low-voltage FPGA power domains.
• Package & Mounting  1365-FCBGA package (35 × 35 mm) in a surface-mount BFBGA format for compact board-level integration.
• Temperature & Grade  Extended grade device rated for operation from 0 °C to 110 °C and compliant with RoHS environmental requirements.

Typical Applications

• High-density digital processing  Use the device for compute-intensive FPGA workloads that need large logic and memory resources on-chip.
• Multi-channel I/O systems  Leverage 364 I/O pins for designs with many parallel interfaces or mixed-signal I/O routing requirements.
• Embedded acceleration and prototyping  Implement custom accelerators and system prototypes that require substantial programmable fabric and on-chip RAM.

Unique Advantages

• Very large logic resource: 2,252,250 logic elements enable consolidation of complex functions into a single device, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 78 Mbits of embedded memory minimizes external memory dependencies and improves data-path latency.
• High I/O count: 364 pins support broad connectivity options, simplifying integration with high-channel systems and parallel interfaces.
• Compact, surface-mount package: The 1365-FCBGA (35×35 mm) package delivers high density in a board-friendly surface-mount form factor.
• Extended operating range: Rated from 0 °C to 110 °C and RoHS compliant to meet thermal and environmental needs in many electronic systems.

Why Choose XCVU23P-L2VSVA1365E?

The XCVU23P-L2VSVA1365E combines a very high logic count, substantial embedded memory, and a large I/O complement in a single Virtex® UltraScale+™ FPGA from AMD. This combination provides a highly integrated platform for designers who need to consolidate complex digital functions and large data buffers without spreading the design across multiple devices.

Ideal for engineering teams building data-intensive or I/O-heavy systems, this extended-grade, surface-mount FPGA offers a balance of performance, integration density, and thermal operating range that supports long-term design stability and system scalability.

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