XCVU27P-L2FSGA2577E

The XCVU27P-L2FSGA2577E is an AMD Virtex® UltraScale+™ FPGA supplied in a 2577-FCBGA package. It provides a very large programmable logic resource and substantial on‑chip memory for complex digital designs that require high logic density and significant embedded RAM.

With a core voltage window of 698 mV to 742 mV, an extended temperature grade (0 °C to 100 °C), and RoHS compliance, this device is specified for surface-mount applications that need large I/O capability and a compact, high‑pin‑count package footprint.

Key Features

• Logic Capacity  Approximately 2,835,000 logic elements, enabling implementation of large, highly parallel logic designs.
• Embedded Memory  Approximately 74.3 Mbits of on‑chip RAM for buffering, lookup tables, and state storage without external memory dependency.
• I/O Resources  448 user I/O pins to support high‑port connectivity and multiple interface lanes directly from the FPGA.
• Package & Mounting  2577-FCBGA (52.5 × 52.5 mm) package in a 2577-BBGA form factor; surface-mount mounting for dense PCB implementations.
• Power Supply Range  Specified voltage supply window from 698 mV to 742 mV to align with platform power requirements.
• Temperature & Grade  Extended grade with an operating range of 0 °C to 100 °C for designs that require above-ambient operating temperatures.
• Environmental Compliance  RoHS compliant, supporting regulatory and manufacturing requirements for lead‑free assembly.

Typical Applications

• High‑density logic implementations  Large FPGA fabric and abundant logic elements enable complex state machines, custom datapaths, and massively parallel processing within a single device.
• On‑chip data buffering and processing  Approximately 74.3 Mbits of embedded RAM supports local buffering, packet processing, and LUT-based storage without relying solely on external memory.
• Systems requiring extensive I/O  Up to 448 I/O pins accommodate multiple high‑speed interfaces, dense sensor arrays, or broad peripheral connectivity directly from the FPGA.

Unique Advantages

• High logic density: The large logic-element count reduces the need for multi‑device partitioning, simplifying board design and interconnect.
• Substantial on‑chip memory: Approximately 74.3 Mbits of embedded RAM lowers external memory dependency and can improve latency for data‑intensive functions.
• Large I/O complement: 448 I/O pins provide flexibility for designs that require many interfaces or parallel channels.
• Compact high‑pin package: The 2577-FCBGA (52.5 × 52.5 mm) package delivers high pin density in a single surface‑mount footprint suited to compact system boards.
• Designed for above‑ambient operation: Extended grade (0 °C to 100 °C) supports deployments in environments with elevated operating temperatures.
• Regulatory readiness: RoHS compliance facilitates lead‑free manufacturing and environmental conformity.

Why Choose XCVU27P-L2FSGA2577E?

The XCVU27P-L2FSGA2577E combines a very large logic fabric, substantial embedded memory, and a high I/O count in a single 2577‑pin FCBGA package, making it suited to designs that demand concentrated programmable resources and dense connectivity in a compact board area. Its specified voltage range and extended temperature grade provide clear, verifiable electrical and thermal operating bounds for system integration.

This device is appropriate for engineering teams and procurement professionals building complex digital systems where on‑chip resources, I/O capacity, and package density are key selection criteria. RoHS compliance and surface‑mount packaging support contemporary manufacturing and assembly processes.

Request a quote or submit an inquiry to obtain pricing and availability for the XCVU27P-L2FSGA2577E.