XCVU29P-2FIGD2104E

The XCVU29P-2FIGD2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It combines very large programmable logic capacity with substantial on-chip memory and a high I/O count in a 2104-FCBGA package.

Key device characteristics include 3,780,000 logic elements, approximately 99 Mbits of embedded memory, up to 676 I/O, a surface-mount 2104-FCBGA (52.5×52.5) package, a supply voltage range of 825 mV to 876 mV, and an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant and specified at Extended grade.

Key Features

• Core Logic — 3,780,000 logic elements provide very large programmable logic capacity for complex designs.
• Embedded Memory — Total on-chip RAM of 99,090,432 bits, or approximately 99 Mbits of embedded memory, for data buffering and local storage.
• I/O Density — Up to 676 I/O pins to support wide external connectivity and multi-channel interfacing.
• Power — Device supply voltage specified between 825 mV and 876 mV for core operation.
• Package & Mounting — 2104-FCBGA (52.5×52.5) supplier device package with surface-mount mounting; package case listed as 2104-BBGA, FCBGA.
• Operating Range & Grade — Operating temperature range of 0 °C to 100 °C and Extended grade.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• Large programmable capacity: 3,780,000 logic elements enable highly parallel and logic-dense implementations.
• Substantial on-chip memory: Approximately 99 Mbits of embedded RAM reduce external memory dependence for many designs.
• High I/O count: 676 I/O pins provide flexibility for multi-channel and multi-interface applications.
• High-pin FCBGA packaging: The 2104-FCBGA (52.5×52.5) package delivers the I/O and die area required for dense FPGA implementations.
• Defined core supply range: Core voltage specified from 825 mV to 876 mV for precise power budgeting.
• Extended grade and RoHS compliance: Specified for an operating range of 0 °C to 100 °C and compliant with RoHS requirements.

Why Choose XCVU29P-2FIGD2104E?

The XCVU29P-2FIGD2104E positions itself as a high-capacity FPGA option within the Virtex UltraScale+ family, combining millions of logic elements, significant embedded memory, and a high I/O count in a single-socket 2104-FCBGA package. Its electrical and thermal specifications make it suitable for designs that require large programmable resource pools and substantial on-chip storage.

This device is appropriate for engineering teams and procurement seeking a high-density FPGA from AMD with a defined supply voltage window, extended temperature rating, and RoHS compliance—providing a clear, verifiable specification set for integration into complex hardware designs.

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