XCVU29P-2FIGD2104I

The XCVU29P-2FIGD2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) offered in a 2104‑FCBGA package. It provides a high density of programmable logic and embedded memory for designs requiring large on‑chip resources and extensive I/O connectivity.

With millions of logic elements, approximately 99 Mbits of embedded memory and 676 I/O, this device targets applications that need significant logic capacity, on‑chip RAM, and a compact surface‑mount FCBGA package in an industrial temperature range.

Key Features

• Logic Capacity — 3,780,000 logic elements (cells) to support large, complex digital designs and system integration.
• Embedded Memory — Approximately 99 Mbits of on‑chip RAM for buffering, caching and state storage within the FPGA fabric.
• I/O Density — 676 user I/O pins to interface with high‑pin‑count systems and multiple external peripherals.
• Package — 2104‑FCBGA (52.5 × 52.5 mm) surface‑mount package providing a high‑pin‑count footprint for dense board layouts.
• Voltage Range — Core supply specified from 825 mV to 876 mV to match system power rails and regulator designs.
• Temperature Range — Industrial operating range from −40 °C to 100 °C suitable for demanding thermal environments.
• Compliance — RoHS compliant.

Typical Applications

• Large‑scale digital processing — Use the device’s multi‑million logic‑element capacity and extensive embedded RAM for implementing complex finite state machines, datapaths, and custom processors.
• High‑pin connectivity systems — Leverage 676 I/O pins for multi‑lane interfaces, parallel I/O arrays, and board‑level integration requiring many external connections.
• Embedded memory‑intensive designs — Approximately 99 Mbits of on‑chip RAM supports buffering, packet processing, and data staging within the FPGA fabric.

Unique Advantages

• High logic density: 3,780,000 logic elements enable consolidation of multiple functions into a single device, reducing system complexity and bill of materials.
• Significant on‑chip memory: Approximately 99 Mbits of embedded RAM reduces reliance on external memory and shortens data paths for lower latency.
• Extensive I/O: 676 I/O pins provide flexibility for connecting numerous peripherals, high‑speed lanes, and board interfaces without multiplexing compromises.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in thermally challenging or outdoor equipment environments.
• Compact, high‑pin package: 2104‑FCBGA (52.5 × 52.5 mm) surface‑mount package balances pin density and PCB real estate for complex system boards.
• Regulatory alignment: RoHS compliance assists in meeting environmental and manufacturing requirements.

Why Choose XCVU29P-2FIGD2104I?

The XCVU29P-2FIGD2104I positions itself as a high‑capacity FPGA solution within the Virtex UltraScale+ family, combining multi‑million logic elements, substantial embedded memory and a large I/O complement in a single industrial‑rated FCBGA package. It suits designs that must integrate extensive digital logic and on‑chip data storage while operating across a wide temperature range.

For engineers and procurement teams requiring scalable FPGA resources with clear electrical and thermal specifications—core voltage range, package dimensions and industrial grade operation—this part provides a consolidated platform for complex system implementations and long‑term deployment.

If you would like pricing, availability or to request a quote for XCVU29P-2FIGD2104I, please submit an inquiry or request a quote through your usual procurement channel.