XCVU29P-L2FSGA2577E

The XCVU29P-L2FSGA2577E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 2577-FCBGA package. It offers high logic capacity, large embedded memory, and a substantial I/O count for complex digital designs and system-level integration.

With millions of logic elements, tens of megabits of on-chip RAM and extensive I/O, this extended-grade device is targeted at designs that require high integration density and flexible hardware programmability.

Key Features

• Core Logic  Approximately 3,780,000 logic elements to implement large-scale digital functions and custom compute pipelines.
• Configurable Logic Blocks  216,000 listed logic block units optimized for scalable design partitioning and parallel implementation.
• Embedded Memory  Approximately 99 Mbits of on-chip RAM to support buffering, large lookup tables, and state storage without external memory.
• I/O Density  448 user I/O pins to support high-pin-count interfaces and multiple parallel I/O channels.
• Power Supply  Operates with supply rails in the range of 698 mV to 742 mV, enabling defined power delivery and planning.
• Package & Mounting  High-pin-count 2577-BBGA / 2577-FCBGA package (2577-FCBGA, 52.5×52.5 mm) designed for surface-mount assembly.
• Grade & Temperature  Extended grade device with an operating temperature range of 0°C to 100°C.
• Environmental Compliance  RoHS compliant, supporting lead-free assembly and environmental regulatory requirements.

Typical Applications

• High-density FPGA compute  Implement large custom accelerators and programmable pipelines using the device’s millions of logic elements and substantial embedded memory.
• Data plane and networking  Support high-bandwidth packet processing and multi-channel I/O with 448 user I/O pins.
• Prototyping and emulation  Use the dense logic fabric and on-chip RAM for system-level prototyping and complex hardware verification tasks.
• Signal processing  Deploy large parallel processing blocks and buffering using the embedded RAM and high logic capacity for real-time processing workloads.

Unique Advantages

• High logic capacity: The device’s approximately 3.78 million logic elements enable implementation of very large, integrated designs without extensive partitioning.
• Substantial embedded memory: Approximately 99 Mbits of on-chip RAM reduces reliance on external memory for many buffering and state-storage needs, simplifying board design.
• Extensive I/O connectivity: 448 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and high-speed connectivity options.
• Compact, high-pin-count package: The 2577-FCBGA (52.5×52.5 mm) package concentrates a large number of signals in a surface-mount form factor suitable for dense PCBs.
• Extended operating grade: Rated for 0°C to 100°C operation, supporting a range of deployment environments where extended temperature operation is required.
• RoHS compliant: Supports lead-free manufacturing and environmental compliance for global production.

Why Choose XCVU29P-L2FSGA2577E?

The XCVU29P-L2FSGA2577E positions itself as a high-density programmable fabric that combines millions of logic elements, large embedded memory capacity, and hundreds of I/O pins in a single extended-grade 2577-FCBGA package. It is suited to teams and projects requiring consolidated logic, on-chip storage, and flexible I/O in a compact surface-mount form factor.

For designs demanding scalability and long-term platform stability, this Virtex® UltraScale+™ FPGA delivers the integration needed to reduce external components while supporting complex digital architectures and system-level prototypes.

Request a quote for XCVU29P-L2FSGA2577E today to check availability and receive pricing details tailored to your project requirements.