XCVU31P-3FSVH1924E

The XCVU31P-3FSVH1924E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC providing a large pool of programmable logic and embedded memory in a 1924-ball FCBGA package. With 961,800 logic elements and approximately 24.7 Mbits of embedded memory, this surface-mount FPGA is targeted at designs that require substantial on-chip logic capacity and memory integration.

Designed for extended-grade operation and a compact 1924-FCBGA (45×45) supplier package, the device supports a 208-pin I/O breakout and operates across a supply range of 873 mV to 927 mV with an ambient operating range of 0 °C to 100 °C.

Key Features

• Logic Capacity  Provides 961,800 logic elements, enabling complex programmable logic implementations and high gate-count designs.
• Embedded Memory  Approximately 24.7 Mbits of on-chip RAM for buffering, look-up tables, and state storage directly within the FPGA fabric.
• I/O  208 general I/O pins to support a wide variety of external interfaces and board-level connectivity.
• Package  1924-BBGA / 1924-FCBGA (supplier package: 1924-FCBGA (45×45)) surface-mount package, offering a high-density board footprint.
• Power  Specified core supply operating range from 873 mV to 927 mV to match system power-rail requirements.
• Thermal & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for applications requiring broader thermal tolerance than standard commercial parts.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-density digital processing  Deploys the large logic element count and on-chip memory for complex digital signal processing, protocol handling, or data-path aggregation tasks.
• Custom accelerators  Leverages abundant programmable logic and embedded RAM to implement application-specific compute blocks and hardware accelerators.
• System integration and prototyping  Useful for integrating multiple functions on a single FPGA fabric during system development and verification due to its high resource count.

Unique Advantages

• Substantial on-chip resources: 961,800 logic elements and approximately 24.7 Mbits of embedded memory reduce reliance on external components and simplify PCB design.
• High I/O density: 208 I/O pins provide flexibility for interfacing multiple peripherals, buses, and memory devices on a single board.
• Compact, high-density package: 1924-FCBGA (45×45) package enables a high resource count in a space-efficient footprint.
• Controlled supply range: Specified core voltage range (873 mV–927 mV) supports predictable power planning and rail design.
• Extended-grade reliability: Rated for 0 °C to 100 °C operation to accommodate designs that require wider thermal operating range than standard commercial parts.
• RoHS compliant: Meets environmental compliance expectations for modern electronic assemblies.

Why Choose XCVU31P-3FSVH1924E?

The XCVU31P-3FSVH1924E positions itself as a high-resource Virtex® UltraScale+™ FPGA offering a balance of large programmable logic capacity, embedded memory, and a compact 1924-FCBGA package. Its specifications support complex designs that demand substantial on-chip resources while maintaining a controlled power envelope and an extended operating temperature range.

This device is well suited to engineers and system designers building boards that require dense logic integration, robust I/O options, and a compact form factor, delivering long-term value through consolidation of functions on a single FPGA fabric.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XCVU31P-3FSVH1924E and to discuss how it fits your next FPGA-based design.