XCVU31P-2FSVH1924E

The XCVU31P-2FSVH1924E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC provided in a 1924-BBGA FCBGA package. It delivers a large on-chip resource set with high logic capacity, substantial embedded memory, and a broad I/O complement for complex programmable logic designs.

This device is supplied in an extended grade, operates from 0–100 °C, and requires a core voltage supply in the range of 825 mV to 876 mV—features that support integration into demanding system designs that need significant programmable logic and embedded storage.

Key Features

• Logic Capacity — 961,800 logic elements provide a high-density fabric for implementing complex digital functions and large-scale logic designs.
• Embedded Memory — Approximately 24.75 Mbits of on-chip RAM to support data buffering, caches, and state storage for compute and signal processing tasks.
• I/O Resources — 208 programmable I/O pins to interface with peripherals, sensors, transceivers, and system buses.
• Package — 1924-FCBGA package (45×45 mm) offering a compact, high-pin-count footprint for space-constrained boards.
• Power Supply — Core supply range of 825 mV to 876 mV for predictable power planning and supply design.
• Operating Range & Grade — Extended grade with an operating temperature range of 0–100 °C for deployment in thermally controlled or industrial-adjacent environments.
• RoHS Compliant — Meets RoHS standards for reduced hazardous substances.

Typical Applications

• Hardware Acceleration — Leverages 961,800 logic elements and ~24.75 Mbits of on-chip RAM to implement custom accelerators and offload compute-intensive tasks.
• Prototyping and System Development — High logic density and 208 I/O make this device suitable for complex prototypes and verification platforms that require numerous external interfaces.
• Signal Processing and Embedded Compute — The combination of large embedded memory and extensive logic resources supports DSP kernels, packet processing, and real-time data paths.

Unique Advantages

• High logic and memory density: 961,800 logic elements and approximately 24.75 Mbits of embedded RAM allow large designs to fit on a single device, reducing board-level partitioning.
• Substantial I/O capability: 208 I/O pins enable broad external connectivity without additional multiplexing or I/O expanders.
• Compact high-pin-count package: The 1924-FCBGA (45×45) footprint supports high integration in space-constrained system designs.
• Predictable power planning: Defined core voltage range (825 mV–876 mV) simplifies power-supply design and validation.
• Extended operating range: 0–100 °C operating temperature and extended grade classification support deployments in controlled industrial or commercial environments.
• Regulatory compliance: RoHS compliance aligns with modern environmental requirements for electronic assemblies.

Why Choose XCVU31P-2FSVH1924E?

The XCVU31P-2FSVH1924E combines large-scale programmable logic, substantial embedded memory, and a high I/O count in a single 1924-FCBGA package. These characteristics make it suited to designs that require consolidation of complex functions—reducing board-level complexity and enabling scalable implementations.

Engineers and procurement teams seeking a high-density FPGA solution for compute acceleration, prototyping, or resource-intensive embedded applications will find the device’s mix of capacity, package density, and operating specifications beneficial for long-term platform development and integration.

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