XCVU31P-1FSVH1924E

The XCVU31P-1FSVH1924E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC provided in a 1924‑BBGA FCBGA package. It delivers large programmable logic capacity and embedded memory for designs that require substantial on‑chip resources and flexible I/O.

This device is intended for applications that need high logic element counts, significant on‑chip RAM, and a high pin count in a surface‑mount FCBGA package, while operating in an extended temperature range.

Key Features

• Logic Capacity 961,800 logic elements with 54,960 CLBs to implement complex digital functions and large FPGA designs.
• Embedded Memory Approximately 24.7 Mbits of on‑chip RAM to support buffering, data storage, and memory‑intensive algorithms.
• I/O 208 user I/O pins to interface with external components and high‑pin‑count systems.
• Package 1924‑BBGA (1924‑FCBGA) surface‑mount package with a 45×45 mm supplier device package footprint for high‑density board designs.
• Power Core voltage supply range of 825 mV to 876 mV for the device core power domain.
• Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C.
• RoHS Compliance RoHS compliant for environmental regulatory alignment.

Typical Applications

• Custom digital processing — Implement large, custom logic functions and data paths using the device’s extensive logic element and CLB resources.
• Memory‑intensive algorithms — Use the approximately 24.7 Mbits of embedded RAM for buffering, real‑time data processing, and algorithm acceleration.
• I/O‑rich systems — Deploy in systems that require a high number of user I/Os for interfacing with multiple peripherals and external devices.

Unique Advantages

• High logic density: 961,800 logic elements and 54,960 CLBs provide the capacity to map complex, large‑scale designs on a single device, reducing the need for multiple FPGAs.
• Substantial on‑chip memory: Approximately 24.7 Mbits of RAM enables efficient local data storage and low‑latency access for critical processing tasks.
• Generous I/O count: 208 I/O pins support rich external connectivity and flexible system integration.
• Compact high‑density package: The 1924‑BBGA (45×45 mm FCBGA) package balances high pin count with a compact board footprint for space‑constrained designs.
• Controlled core supply range: Specified core voltage of 825–876 mV allows predictable power planning for the core domain.
• Extended operating range: Extended grade and an operating range of 0 °C to 100 °C support deployment in a variety of standard commercial and industrial environments.

Why Choose XCVU31P-1FSVH1924E?

The XCVU31P‑1FSVH1924E positions itself as a high‑capacity FPGA solution combining extensive logic resources, substantial embedded RAM, and a high I/O count in a 1924‑BBGA FCBGA package. Its specifications make it suitable for designs that demand large programmable logic fabrics, meaningful on‑chip memory, and flexible external interfacing while operating within an extended temperature range.

This part is appropriate for engineering teams and procurement seeking a single FPGA device capable of consolidating complex functions, reducing multi‑device bill of materials, and providing predictable electrical and thermal parameters for system design.

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