XCVU33P-1FSVH2104E

The XCVU33P-1FSVH2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) offered in a 2104-FCBGA package. It delivers high on-chip logic and memory capacity with a large I/O count and is supplied in an extended grade with surface-mount packaging.

Key measurable attributes include 54,960 CLBs, 961,800 logic elements, approximately 24.7 Mbits of embedded memory, 208 user I/Os, a 2104-FCBGA (47.5×47.5 mm) package, an operating voltage range of 825 mV to 876 mV, and an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core Logic  54,960 CLBs corresponding to 961,800 logic elements to support large-scale programmable logic implementations.
• On-chip Memory  Approximately 24.7 Mbits of embedded RAM for buffering, state storage, and memory-intensive logic functions.
• I/O and Packaging  208 user I/Os in a 2104-FCBGA package (supplier package: 2104-FCBGA, 47.5×47.5 mm) for high-density external connectivity in a surface-mount form factor.
• Power  Specified core supply range of 825 mV to 876 mV to match system power rails and enable predictable power budgeting.
• Thermal and Grade  Extended-grade device rated for operation from 0 °C to 100 °C, supporting applications within that temperature window.
• Compliance  RoHS compliant for environmental and manufacturing process compatibility.

Typical Applications

• High-density logic designs  Use the device's 961,800 logic elements and 54,960 CLBs to implement complex, large-scale custom logic architectures.
• On-chip memory–dependent functions  Approximately 24.7 Mbits of embedded RAM support buffering, local storage, and memory-backed data paths.
• High-pin-count interfacing  The 208 I/Os and 2104-FCBGA package facilitate dense external connectivity for systems requiring numerous signal channels.

Unique Advantages

• High logic capacity: 961,800 logic elements and 54,960 CLBs enable implementation of extensive programmable logic directly on-chip, reducing external logic requirements.
• Substantial embedded memory: Approximately 24.7 Mbits of on-chip RAM helps minimize the need for external memory in many designs.
• Dense I/O in an FCBGA package: 208 I/Os in a 2104-FCBGA (47.5×47.5 mm) form factor supports complex board-level integration while remaining surface-mount compatible.
• Defined power envelope: Core voltage specified between 825 mV and 876 mV provides clear parameters for power-supply design and validation.
• Extended-grade thermal range: Rated for 0 °C to 100 °C operation to match designs targeting that temperature window.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory alignment in manufacturing.

Why Choose XCVU33P-1FSVH2104E?

The XCVU33P-1FSVH2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA option for designs that require substantial on-chip logic and memory combined with a large I/O complement in a surface-mount FCBGA package. Its quantified resources—54,960 CLBs, 961,800 logic elements, approximately 24.7 Mbits of embedded RAM, and 208 I/Os—provide a clear foundation for integrating complex programmable functions while maintaining predictable power and thermal parameters.

This extended-grade, RoHS-compliant device is appropriate for customers seeking a measured balance of integration and scalability within the documented voltage and temperature ranges, and for those who require the specified package and I/O density for their board-level implementations.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XCVU33P-1FSVH2104E.