XCVU35P-1FSVH2104E

The XCVU35P-1FSVH2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) supplied in a 2104-FCBGA package. It provides a large programmable fabric, substantial on-chip memory, and a high pin count, addressing designs that require significant logic capacity and flexible I/O integration.

Key device characteristics include approximately 1.9 million logic elements, roughly 49.6 Mbits of embedded memory, 416 I/O, an extended-grade operating range, and a low-voltage core supply window. These specifications support complex digital designs in thermal and power-constrained system environments.

Key Features

• Core Architecture  Virtex UltraScale+ FPGA architecture with 1,906,800 logic elements to support large-scale programmable logic implementations.
• Configurable Logic Blocks  108,960 configurable logic blocks (CLBs) for structured logic partitioning and resource allocation.
• On‑Chip Memory  Approximately 49.6 Mbits of embedded RAM for buffering, state storage, and local memory requirements.
• I/O Capacity & Package  416 user I/O in a 2104-FCBGA (47.5 × 47.5 mm) package, providing broad external connectivity in a compact surface-mount form factor.
• Power and Voltage  Core voltage supply range from 825 mV to 876 mV to match system power-rail constraints and ensure predictable core operation.
• Operating Range & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C suitable for a variety of commercial and demanding embedded applications.
• Mounting & Compliance  Surface-mount FCBGA package and RoHS-compliant construction for modern PCB assembly processes and regulatory alignment.

Typical Applications

• High‑density FPGA compute  Use the large logic element count and abundant on-chip RAM to implement complex parallel processing and acceleration functions.
• Custom digital systems  Implement control, protocol bridging, and custom state machines leveraging the high CLB count and flexible I/O.
• Prototyping and system integration  Integrate extensive programmable logic and 416 I/O signals in a single FCBGA package for board-level prototyping and integration.

Unique Advantages

• High logic capacity: 1,906,800 logic elements provide the headroom to implement large-scale designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 49.6 Mbits of on‑chip RAM reduces reliance on external memory for buffering and local storage.
• Broad I/O in compact package: 416 I/O pins in a 2104-FCBGA (47.5 × 47.5 mm) package enable dense connectivity while supporting surface-mount assembly.
• Predictable power envelope: A defined core voltage window (825–876 mV) helps design stable power distribution networks for the FPGA core.
• Extended-grade operation: Rated for 0 °C to 100 °C to meet a range of commercial and embedded thermal conditions.
• RoHS compliant: Environmentally compliant manufacturing status for global electronics assemblies.

Why Choose XCVU35P-1FSVH2104E?

The XCVU35P-1FSVH2104E positions itself as a high-capacity, highly integrated FPGA option within the Virtex UltraScale+ family. Its combination of nearly 1.9 million logic elements, substantial embedded memory, and 416 I/O in a 2104-FCBGA package makes it suitable for designs that demand significant on-chip resources and dense external connectivity.

This device is well suited to engineering teams developing large digital systems, accelerator fabrics, or complex prototype platforms that require scalability and a predictable electrical and thermal footprint. Extended-grade temperature rating and RoHS compliance contribute to long-term design stability and supply-chain alignment.

Request a quote or submit an inquiry to receive pricing and availability for the XCVU35P-1FSVH2104E and to discuss how it can fit your next design.