XCVU35P-1FSVH2892E

IC FPGA 416 I/O 2892FCBGA
Part Description

Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 416 49597645 1906800 2892-BBGA, FCBGA

Quantity 313 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package2892-FCBGA (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2892-BBGA, FCBGANumber of I/O416Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs108960Number of Logic Elements/Cells1906800
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49597645

Overview of XCVU35P-1FSVH2892E – Virtex® UltraScale+™ FPGA, 2892-FCBGA

The XCVU35P-1FSVH2892E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, delivered in a high-pin-count 2892-FCBGA package (55×55). It combines large logic capacity, substantial on-chip memory, and high I/O density in an extended-grade, surface-mount form factor.

This device is intended for designs that require significant programmable logic, embedded memory, and a dense I/O footprint—offering designers integration and scalability within a compact package and with a core voltage supply range of 825 mV to 876 mV.

Key Features

  • Logic Capacity  Approximately 1,906,800 logic elements providing extensive resources for complex digital designs and large-scale programmable implementations.
  • On-Chip Memory  Approximately 49.6 Mbits of embedded memory to support buffering, large look-up tables, and in-device data storage for compute and signal processing tasks.
  • I/O Density  416 user I/O pins to support multi-channel interfaces, parallel data paths, and dense connectivity requirements.
  • Core Power  Operates with a core voltage supply range of 825 mV to 876 mV to match power-rail requirements for UltraScale+ devices.
  • Package & Mounting  2892-FCBGA (55×55) package in a surface-mount format for high-pin-count board-level integration; package case listed as 2892-BBGA, FCBGA.
  • Temperature & Grade  Extended-grade device with an operating temperature range of 0°C to 100°C suitable for a wide range of commercial and industrial-adjacent environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • High-density digital signal processing  Leverage the device’s large logic element count and on-chip memory for multi-channel DSP, filtering, and real-time data manipulation.
  • FPGA-based prototyping and emulation  Use the extensive logic resources to prototype complex system functions or to emulate hardware architectures at board level.
  • Multi-channel I/O aggregation  Utilize the 416 I/Os to aggregate, route, and bridge numerous high-bandwidth data paths in communication or data acquisition systems.
  • Custom compute and control engines  Implement custom accelerators and control logic that depend on abundant programmable logic and embedded memory.

Unique Advantages

  • Highly integrated logic and memory: The combination of approximately 1.9M logic elements and ~49.6 Mbits of embedded memory reduces external component needs for many designs.
  • Substantial I/O capacity: 416 I/Os enable complex interfacing and high channel counts without sacrificing routing flexibility.
  • Compact, high-pin-count package: The 2892-FCBGA (55×55) package delivers dense connectivity in a board-friendly surface-mount form factor.
  • Extended operating range: 0°C to 100°C operating temperature and extended-grade classification support deployment across a broad set of environments.
  • Controlled core power requirements: Defined core voltage supply range (825 mV–876 mV) facilitates predictable power budgeting and rail design.
  • Regulatory conformity: RoHS compliance aligns with environmental and manufacturing requirements.

Why Choose XCVU35P-1FSVH2892E?

As an AMD Virtex® UltraScale+™ device, the XCVU35P-1FSVH2892E provides designers a high-capacity FPGA solution that balances large programmable logic resources, significant embedded memory, and broad I/O in a single extended-grade FCBGA package. Its specified voltage and temperature ranges make it suitable for complex systems requiring reliable, scalable programmable logic.

This part is well suited for engineering teams building high-density digital systems, prototypes of complex SoCs, or I/O-intensive applications that benefit from integrated resources and a compact footprint.

Request a quote or submit a quote request to get pricing and availability for the XCVU35P-1FSVH2892E.

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