XCVU35P-2FSVH2104E

The XCVU35P-2FSVH2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) from AMD, supplied in a 2104-FCBGA package. It provides very large programmable logic capacity and on-chip memory for complex digital designs that require significant integration in a single device.

With 1,906,800 logic elements, approximately 49.6 Mbits of embedded memory and 416 I/O, this FPGA targets applications that need dense logic, substantial embedded RAM and a high I/O count while operating from a 825–876 mV core supply and within a 0 °C to 100 °C operating range.

Key Features

• Logic Capacity  1,906,800 logic elements for implementing large, complex digital functions and consolidating multiple design blocks onto a single FPGA.
• Embedded Memory  Approximately 49.6 Mbits of on-chip RAM to support buffering, lookup tables and data-path storage without external memory for many functions.
• I/O Count  416 user I/O pins to accommodate wide interfaces, parallel buses and multiple high-density connections.
• Package and Mounting  2104-FCBGA (47.5 × 47.5 mm) surface-mount package providing a high-pin-count footprint for dense system integration.
• Power Supply  Core voltage operating range 825 mV to 876 mV for the device core supply requirements.
• Operating Range and Grade  Extended grade device rated for operation from 0 °C to 100 °C.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital processing  Implement complex logic-intensive algorithms within a single device using the large logic element count and embedded memory.
• Multi-interface systems  Consolidate multiple parallel and serial interfaces leveraging 416 I/O to route signals and peripherals directly to the FPGA.
• Memory-intensive buffering  Use the approximately 49.6 Mbits of on-chip RAM for data buffering, FIFOs and storage close to logic to reduce external memory needs.

Unique Advantages

• High logic density: 1,906,800 logic elements enable integration of large or multiple subsystems into one FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 49.6 Mbits of embedded RAM supports significant data-path and buffering requirements without relying solely on external memory.
• Ample I/O resources: 416 I/O pins accommodate broad connectivity needs for complex systems and multiple peripheral interfaces.
• High-pin-count package for integration: The 2104-FCBGA (47.5 × 47.5 mm) package supports dense signal routing and system-level consolidation in a surface-mount form factor.
• Designed for extended temperature operation: Rated 0 °C to 100 °C with extended grade classification for deployments that require that operating range.
• Regulatory readiness: RoHS compliance aids in meeting environmental and assembly requirements for lead-free manufacturing.

Why Choose XCVU35P-2FSVH2104E?

The XCVU35P-2FSVH2104E positions itself as a high-capacity, highly integrated FPGA option for designs that demand large programmable logic, significant embedded memory and broad I/O in a single package. Its combination of 1,906,800 logic elements, approximately 49.6 Mbits of on-chip RAM and 416 I/O make it suitable for consolidating complex digital functions and reducing system BOM.

Offered in a 2104-FCBGA (47.5 × 47.5 mm) surface-mount package with RoHS compliance and extended grade operation from 0 °C to 100 °C, this device is aimed at developers and procurement teams building dense, memory-hungry and I/O-rich FPGA-based solutions where long-term scalability and device-level integration are priorities.

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