XCVU35P-3FSVH2892E

The XCVU35P-3FSVH2892E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers high logic density and substantial on-chip memory in a 2892-FCBGA package, suitable for designs that require extensive programmable logic, abundant embedded RAM, and large I/O counts.

Built for applications that need configurable, high-capacity digital logic, this device combines approximately 1,906,800 logic elements with roughly 49.6 Mbits of embedded memory and 416 I/O to support complex, high-bandwidth designs while operating within a defined supply and temperature envelope.

Key Features

• Core Logic  Approximately 1,906,800 logic elements to implement large-scale programmable logic and complex combinational/sequential designs.
• Embedded Memory  Approximately 49.6 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive functions without relying solely on external memory.
• I/O Capacity  416 I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals or subsystems.
• Package  2892-FCBGA (55 × 55 mm) package case providing high pin-count surface-mount integration for dense board designs.
• Power  Core supply range specified at 0.873–0.927 V to meet device power requirements in target system designs.
• Thermal and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications within that thermal envelope.
• Assembly  Surface mount device (FCBGA) suitable for standard SMT assembly processes.
• RoHS Compliance  Device is RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

• High-density digital signal processing  Use the device’s large logic capacity and on-chip RAM to implement multi-channel DSP pipelines and custom signal processing functions.
• Data-path acceleration  With substantial logic and I/O resources, accelerate packet processing, protocol bridging, or custom compute kernels in network and compute systems.
• Complex system control  Integrate numerous control functions and peripheral interfaces on a single FPGA using the high I/O count and embedded memory for state and buffering.

Unique Advantages

• High logic density: Approximately 1,906,800 logic elements enable consolidation of large designs into a single device, reducing system complexity.
• Significant on-chip memory: Roughly 49.6 Mbits of embedded RAM supports large buffers and state storage without immediate dependence on external memory.
• Large I/O count: 416 I/O pins accommodate wide interfaces and multiple peripherals, simplifying board-level routing for complex systems.
• High pin-count FCBGA package: The 2892-FCBGA (55×55) package provides the connectivity required for dense, performance-oriented designs.
• Designed for standard SMT assembly: Surface-mount mounting ensures compatibility with common board assembly flows.
• Environmentally compliant: RoHS compliance supports lead-free manufacturing processes.

Why Choose XCVU35P-3FSVH2892E?

The XCVU35P-3FSVH2892E positions itself as a high-capacity, flexible FPGA option for designers needing substantial programmable logic, embedded memory, and broad I/O connectivity within a single package. Its extended-grade specification and defined power and temperature ranges make it suitable for systems operating within those limits.

This device is well suited for development teams and product designs that require scalability, reduced board-level component count, and access to a large pool of on-chip resources to implement complex custom logic and data-path functions while maintaining RoHS-compliant assembly.

Request a quote or submit an inquiry to start the procurement process for the XCVU35P-3FSVH2892E and discuss availability, pricing, and lead times.