XCVU37P-2FSVH2892E

The XCVU37P-2FSVH2892E is a Virtex® UltraScale+™ FPGA IC designed for high-capacity logic integration and dense system I/O. It provides a large number of logic resources, substantial on-chip memory, and a high I/O count in a 2892-ball FCBGA package.

Key Features

• Core Logic  Provides 162,960 logic elements and 2,851,800 logic cells to support complex, high-density digital designs.
• Embedded Memory  Approximately 74.34 Mbits of embedded memory (74,344,038 total RAM bits) for on-chip storage and buffering needs.
• I/O Capacity  624 I/O pins to support extensive peripheral and system-level connectivity.
• Power Supply Range  Nominal core supply range specified at 825 mV to 876 mV.
• Package & Mounting  2892-BBGA FCBGA package (supplier device package: 2892-FCBGA, 55×55) optimized for surface-mount PCB assembly.
• Operating Temperature  Specified for 0°C to 100°C operation, with an Extended grade designation.
• Regulatory  RoHS compliant.

Unique Advantages

• High logic density: 162,960 logic elements and 2,851,800 logic cells provide capacity for large-scale integration and complex logic implementations, reducing the need for multiple devices.
• Substantial on-chip memory: Approximately 74.34 Mbits of embedded memory enables significant local buffering and data storage without external memory.
• Extensive I/O: 624 I/O pins support broad external interfacing and parallel connectivity for system-level integration.
• Compact, surface-mount package: 2892-FCBGA (55×55) package allows high-pin-count implementations in a single, manufacturable package.
• Controlled core voltage: Defined supply range (825 mV to 876 mV) supports predictable power planning and board-level power design.
• Extended operating range: Specified 0°C to 100°C operating temperature for deployments within that thermal envelope.

Why Choose XCVU37P-2FSVH2892E?

The XCVU37P-2FSVH2892E positions itself as a high-capacity Virtex® UltraScale+™ FPGA option that combines large logic resources, significant embedded memory, and a high I/O count in a 2892-ball FCBGA package. Its electrical and thermal specifications support designs that require dense on-chip resources and extensive external connectivity.

This device is suited for engineering teams and procurement looking for a single-chip solution to consolidate complex logic functions and on-chip storage while maintaining a manufacturable surface-mount package and defined operating parameters. Its RoHS compliance and extended-grade temperature rating support long-term deployment within the specified conditions.

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