XCVU37P-3FSVH2892E

The XCVU37P-3FSVH2892E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC offering extremely large programmable logic capacity and embedded memory for demanding digital designs. Architected for applications that require high logic density, substantial on‑chip RAM, and a large I/O count, this device provides the hardware building blocks to implement complex custom logic and system integration.

Key hardware attributes include 2,851,800 logic elements, approximately 74.3 Mbits of embedded memory, and 624 I/O pins in a 2892‑FCBGA (55×55) package, with surface‑mount mounting and an extended operating grade.

Key Features

• Core Logic Capacity 2,851,800 logic elements to accommodate large-scale programmable logic implementations.
• Embedded Memory Approximately 74.3 Mbits of on‑chip RAM for buffering, state storage, and data‑intensive processing tasks.
• I/O Density 624 I/O pins to support extensive peripheral and high‑pin‑count interfacing requirements.
• Package and Mounting 2892‑BBGA / 2892‑FCBGA (55×55) package in a surface‑mount form factor for compact, high‑density board designs.
• Power Supply Range Operates across a core supply window of 873 mV to 927 mV for predictable power planning.
• Operating Grade and Temperature Extended grade device rated for operation from 0 °C to 100 °C to match a range of commercial and extended‑environment deployments.
• Standards Compliance RoHS compliant to meet common environmental regulations for electronic components.

Typical Applications

• Custom Hardware Acceleration — Implements large custom logic functions using 2,851,800 logic elements and substantial embedded RAM for offloading compute workloads.
• High‑Density I/O Systems — Supports systems requiring many external interfaces with 624 I/O pins and a 2892‑FCBGA (55×55) package for dense pin routing.
• Complex Prototyping and Integration — Surface‑mount package and extended operating range make the device suitable for development platforms and production-level integration where high logic capacity is needed.

Unique Advantages

• Massive Logic Resources: 2,851,800 logic elements provide headroom for complex, multi‑function designs without immediate partitioning across multiple devices.
• Significant On‑Chip Memory: Approximately 74.3 Mbits of embedded RAM reduces external memory dependency for latency‑sensitive buffering and state storage.
• High I/O Count: 624 I/O pins enable broad connectivity to peripherals, mezzanine cards, and multi‑lane interfaces.
• Compact, High‑Density Package: 2892‑FCBGA (55×55) footprint supports dense PCB layouts and allows designers to maximize board real estate.
• Predictable Power Window: Defined supply range (873 mV–927 mV) simplifies power delivery design and verification.
• Extended Operating Grade: Rated from 0 °C to 100 °C and RoHS compliant for deployments that require extended commercial temperature support.

Why Choose XCVU37P-3FSVH2892E?

The XCVU37P-3FSVH2892E positions itself as a high‑capacity, integration‑focused FPGA from AMD, delivering substantial logic elements, embedded memory, and a large I/O complement in a single device. It is well suited for design teams and system integrators needing to consolidate complex logic into a compact, surface‑mount package while maintaining clear power and thermal parameters.

For projects that demand scalability and predictable hardware resources—whether for custom acceleration, high‑pin‑count interfaces, or advanced prototyping—this Virtex UltraScale+ device offers a balanced combination of capacity, connectivity, and extended‑grade operation backed by a leading FPGA vendor.

Request a quote or submit a parts inquiry to receive pricing and availability information for the XCVU37P-3FSVH2892E. Our team will respond with lead times and ordering options tailored to your project needs.