XCVU3P-2FFVC1517I

The XCVU3P-2FFVC1517I is an AMD Virtex® UltraScale+™ field programmable gate array (FPGA) IC designed for applications that require large programmable logic capacity, substantial on-chip memory, and high I/O density. This device provides 862,050 logic elements, approximately 118 Mbits of embedded memory, and 520 I/O pins in a 1517-FCBGA (40×40) package.

Specified for industrial use, the device operates over a supply range of 825 mV to 876 mV and supports an ambient temperature range of −40 °C to 100 °C. It is offered in a surface-mount FCBGA package and is RoHS compliant.

Key Features

• Core Logic 862,050 logic elements provide substantial programmable capacity for complex custom logic implementations.
• Embedded Memory Approximately 118 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive logic functions.
• I/O Count 520 user I/O pins suitable for designs requiring many parallel interfaces or extensive signal connectivity.
• Power Supply Operates from 825 mV to 876 mV supply rails, enabling precise low-voltage integration in power-sensitive systems.
• Package & Mounting 1517-BBGA (1517-FCBGA, 40×40) surface-mount package for high pin count and dense board-level integration.
• Temperature & Grade Industrial-grade device rated for −40 °C to 100 °C operation, suitable for demanding environmental conditions.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density logic systems Implement large-scale custom logic and complex control algorithms using the device’s 862,050 logic elements.
• Memory-intensive programmable designs Use approximately 118 Mbits of embedded memory for data buffering, LUT storage, and on-chip data management.
• High I/O-count interfaces Support designs that require extensive parallel or multi-channel connectivity with 520 I/O pins.
• Industrial systems Deploy in systems that require industrial-grade temperature operation from −40 °C to 100 °C.

Unique Advantages

• Highly integrated logic and memory: Combines 862,050 logic elements with approximately 118 Mbits of embedded RAM to reduce external component count and simplify board-level design.
• High I/O density: 520 I/O pins deliver the connectivity needed for multi-interface and multi-channel designs without sacrificing package density.
• Industrial temperature range: Rated for −40 °C to 100 °C operation to support reliable performance in challenging environments.
• Compact high-pin-count package: The 1517-FCBGA (40×40) package enables dense board integration while providing a large footprint of I/O and logic resources.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and end-product compliance needs.

Why Choose XCVU3P-2FFVC1517I?

The XCVU3P-2FFVC1517I positions itself as a high-capacity, industrial-grade FPGA that combines extensive programmable logic, substantial embedded memory, and a large I/O complement in a compact FCBGA package. Its electrical specifications and temperature rating make it suited for engineers designing robust, high-density programmable systems that require on-chip resources and broad connectivity.

This device is appropriate for teams seeking scalability and integration—providing measurable on-chip resources that can reduce external components and simplify system architecture while meeting industrial operating conditions.

Request a quote or submit a procurement inquiry for the XCVU3P-2FFVC1517I to receive pricing and availability information.