XCVU440-1FLGB2377C

The XCVU440-1FLGB2377C is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) in a 2377-BBGA FCBGA package. It provides very high logic density, extensive embedded memory, and a large I/O count for complex, programmable digital designs.

Designed for commercial-grade applications, this device targets high-density programmable logic implementations that require substantial on-chip resources and broad connectivity while conforming to RoHS requirements.

Key Features

• Core Logic Approximately 5,540,850 logic elements for implementing large-scale digital designs and custom hardware functions.
• Embedded Memory Approximately 90.7 Mbits of on-chip RAM to support buffering, data storage, and high-throughput processing within the FPGA fabric.
• High I/O Count 1,300 user I/O pins to support dense peripheral connectivity and multi-channel interfaces.
• Power Specified voltage supply range of 922 mV to 979 mV for device core power provisioning.
• Package & Mounting 2377-BBGA, FCBGA package (supplier device package: 2377-FCBGA, 50×50) in a surface-mount form factor for PCB assembly.
• Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance for regulatory compatibility.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded memory to implement complex signal processing, algorithm acceleration, or custom compute pipelines.
• Multi-channel interface aggregation — The 1,300 I/O pins support designs that aggregate numerous high-speed or parallel interfaces on a single device.
• Custom hardware prototyping — Suitable for development boards and prototypes that require substantial on-chip resources in a surface-mount FCBGA package.

Unique Advantages

• High logic density: The device’s approximately 5.54 million logic elements enable consolidation of large designs into a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 90.7 Mbits of on-chip RAM provide local storage for buffering and state retention without external memory dependencies.
• Extensive I/O capability: 1,300 available I/Os accommodate complex connectivity requirements and multi-channel systems.
• Compact surface-mount package: The 2377-FCBGA (50×50) package supports PCB integration in space-constrained applications while maintaining high resource counts.
• Commercial-grade operating range: Rated for 0 °C to 85 °C operation, aligning with standard commercial deployment environments.
• RoHS compliant: Meets RoHS requirements for materials and environmental compliance.

Why Choose XCVU440-1FLGB2377C?

The XCVU440-1FLGB2377C combines very high logic capacity, substantial embedded memory, and broad I/O capability in a surface-mount FCBGA package, delivering a compact platform for complex programmable designs. Its commercial-grade specification and RoHS compliance make it suitable for a wide range of non-automotive, commercial applications where on-chip integration and connectivity are primary requirements.

This device is well suited for design teams and procurement groups seeking a high-density FPGA for advanced prototyping, compute acceleration, or multi-interface aggregation that benefits from a single-device implementation and established vendor ecosystem support.

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