XCVU440-2FLGB2377E

The XCVU440-2FLGB2377E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) provided in a 2377-FCBGA (50 × 50 mm) package. It delivers very large logic capacity, extensive on-chip memory, and a high I/O count for complex, high-density digital designs.

Designed for surface-mount board assembly and RoHS-compliant production, this extended-grade device supports operation from 0 °C to 100 °C and a core supply voltage range of 922 mV to 979 mV.

Key Features

• Core Logic Built with 5,540,850 logic elements to support large-scale FPGA implementations and dense digital integration.
• Embedded Memory Approximately 91 Mbits of embedded memory (90,726,400 bits) for data buffering, frame storage, and high-throughput on-chip memory tasks.
• I/O Capacity Up to 1,300 user I/O pins to accommodate complex external interfacing and multi-channel connectivity.
• Power Supply Range Core voltage supply specified from 922 mV to 979 mV to align with system power-rail design requirements.
• Package & Mounting 2377-BBGA, FCBGA package in a 2377-FCBGA (50×50 mm) form factor with surface-mount mounting for standard PCB assembly flows.
• Grade & Temperature Extended-grade device rated for operation from 0 °C to 100 °C to meet a range of commercial and extended-environment deployments.
• Environmental Compliance RoHS-compliant construction for regulatory and supply-chain alignment.

Typical Applications

• Large-scale Digital Systems Implement extensive custom logic with the device’s 5,540,850 logic elements to realize complex state machines, datapaths, and control logic.
• On-chip Data Buffering Use the approximately 91 Mbits of embedded memory for frame buffering, packet queues, and intermediate data storage in high-throughput designs.
• High-density I/O Designs Leverage 1,300 I/Os to connect multiple peripherals, sensors, and high-speed interfaces on a single FPGA platform.

Unique Advantages

• High Logic Capacity: 5,540,850 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial On-chip Memory: Approximately 91 Mbits of embedded memory supports large buffers and reduces dependence on external memory components.
• Extensive Connectivity: 1,300 I/Os provide flexibility for multi-channel and mixed-signal interfacing without auxiliary multiplexers or expanders.
• Standard Surface-Mount Package: 2377-FCBGA (50×50 mm) package facilitates established PCB assembly processes and mechanical integration.
• Regulatory Alignment: RoHS compliance simplifies product deployment in regions and supply chains requiring hazardous-substance restrictions.

Why Choose XCVU440-2FLGB2377E?

The XCVU440-2FLGB2377E positions itself as a high-capacity Virtex® UltraScale™ FPGA option for designs demanding large logic fabrics, significant on-chip memory, and broad I/O connectivity within a surface-mount, 2377-FCBGA package. Its extended-grade temperature range and RoHS compliance make it suitable for a variety of production environments where these specific electrical and mechanical characteristics are required.

Engineers and procurement teams seeking a single-device solution to consolidate complex digital logic, buffering, and extensive interfacing will find this FPGA suited to scalable, high-density implementations while matching explicit supply-voltage and temperature requirements.

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