XCVU440-3FLGA2892E

The XCVU440-3FLGA2892E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD designed for high-density programmable logic applications. It delivers substantial on-chip resources—including hundreds of thousands of CLBs, millions of logic elements, and large embedded RAM—paired with a high I/O count and an FCBGA package for surface-mount system designs.

This device is targeted at designs that require extensive logic capacity, significant embedded memory, and broad external connectivity while operating within an extended temperature range and a defined core voltage window.

Key Features

• Core Logic — 316,620 CLBs supporting a total of 5,540,850 logic elements to implement large-scale digital designs.
• Embedded Memory — Approximately 90.7 Mbits of on-chip RAM (90,726,400 bits) for buffering, data storage, and intermediate processing.
• I/O Capacity — 1,456 user I/O pins to accommodate high-pin-count interfaces and parallel connectivity requirements.
• Power — Core voltage supply range of 970 mV to 1.03 V to match system power rails and design constraints.
• Package & Mounting — 2892-FCBGA (55×55) supplier device package / 2892-BBGA package case; surface-mount mounting type for PCB integration.
• Operating Range & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement compute- and logic-heavy algorithms using millions of logic elements and abundant CLBs.
• On-chip buffering and data management — Leverage approximately 90.7 Mbits of embedded RAM for large FIFO, cache, and temporary data storage needs.
• High-pin-count interface systems — Use 1,456 I/O to connect multiple parallel buses, high-speed channels, or numerous peripheral interfaces.

Unique Advantages

• Extensive programmable capacity: 5,540,850 logic elements and 316,620 CLBs enable complex designs and substantial HDL resource mapping.
• Large on-chip memory: Approximately 90.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-processing tasks.
• High connectivity: 1,456 I/O pins support dense external I/O integration, minimizing the need for additional interface components.
• Surface-mount FCBGA packaging: 2892-FCBGA (55×55) package facilitates board-level assembly and compact system layouts.
• Defined power envelope: Core supply range of 970 mV to 1.03 V helps ensure predictable power design and rail selection.
• Extended temperature operation: Rated for 0 °C to 100 °C operation to meet a variety of standard commercial and extended-range deployment scenarios.

Why Choose XCVU440-3FLGA2892E?

The XCVU440-3FLGA2892E combines very large logic capacity, significant embedded memory, and a high I/O count in a 2892-FCBGA surface-mount package, making it suitable for designs that demand integration of complex digital functions and broad external connectivity. Its defined voltage range and extended operating temperature grade support stable deployment within specified system environments.

This device is well suited to developers and teams working on large-scale programmable logic implementations who need on-chip memory, abundant I/O, and a compact package footprint to streamline board-level integration and maintain a focused BOM.

Request a quote or submit an inquiry to start the procurement process for the XCVU440-3FLGA2892E and discuss availability and pricing details.