XCVU45P-3FSVH2104E

The XCVU45P-3FSVH2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2104-FCBGA package. It combines high logic capacity, substantial embedded memory, and a large I/O complement to support complex programmable digital designs.

Designed for surface-mount deployment and extended temperature operation, this device targets applications that require significant on-chip logic, memory resources, and high pin-count interfacing while maintaining RoHS compliance.

Key Features

• Logic Capacity 108,960 CLBs and 1,906,800 logic elements provide extensive programmable fabric for large-scale digital designs.
• Embedded Memory Approximately 49.6 Mbits of on-chip RAM to support large data buffers, state machines, and real-time processing tasks.
• I/O Resources 416 I/O pins for high-density external interfacing and connectivity to multiple peripherals or high-speed transceivers.
• Power Supply Operates from a core voltage supply range of 825 mV to 876 mV, enabling precise core power management in system designs.
• Package and Mounting 2104-BBGA / 2104-FCBGA package (2104-FCBGA (47.5x47.5)) with surface-mount mounting for compact board-level integration.
• Temperature and Grade Extended grade device rated for operation from 0 °C to 100 °C to meet a range of deployed-environment requirements.
• Regulatory Compliance RoHS compliant for conformity with current materials and environmental regulations.

Typical Applications

• High-density digital processing — For designs that require large numbers of logic elements and on-chip RAM to implement complex state machines, custom datapaths, or protocol processing.
• Multi-interface systems — Leverages 416 I/O pins to connect to multiple peripherals, sensors, or external memory devices in high-pin-count applications.
• Embedded acceleration and offload — Suitable for accelerating workloads where significant programmable logic and memory are needed on-chip to reduce external component count.

Unique Advantages

• High logic density: Large CLB and logic element counts enable integration of complex functions on a single device, reducing system-level component count.
• Substantial embedded memory: Approximately 49.6 Mbits of on-chip RAM supports deep buffering and local data storage, minimizing external memory bandwidth needs.
• Extensive I/O capability: 416 I/O pins provide flexibility for dense connectivity and multi-channel interfacing without resorting to external multiplexing.
• Compact, manufacturable package: 2104-FCBGA surface-mount package allows for board-level space savings while supporting high pin counts.
• Extended temperature rating: Operation from 0 °C to 100 °C supports deployment in a range of controlled and semi-controlled environments.
• RoHS compliant: Meets environmental materials requirements for modern electronics manufacturing.

Why Choose XCVU45P-3FSVH2104E?

The XCVU45P-3FSVH2104E delivers a combination of high logic element count, substantial embedded memory, and a large I/O complement in a 2104-FCBGA surface-mount package. Its extended temperature rating and RoHS compliance make it suitable for system designs that demand significant on-chip resources and compact board integration.

This device is well suited for engineering teams building complex programmable systems that require scalability in logic and memory capacity, high pin-count interfacing, and precise core voltage management. It offers a practical balance of integration and deployment-ready features for demanding FPGA-based designs.

Request a quote or submit an inquiry to obtain pricing and availability for the XCVU45P-3FSVH2104E and to discuss how it fits your next design.