XCVU47P-1FSVH2892E

The XCVU47P-1FSVH2892E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC offering very large logic and memory capacity in a high-pin‑count FCBGA package. Its specifications include 2,851,800 logic elements, approximately 74.3 Mbits of embedded memory, and 624 I/O pins, providing a platform for complex, high-density programmable logic implementations.

Packaged as a 2892-FCBGA (55×55) and rated for extended-grade operation with an operating temperature range of 0 °C to 100 °C, this surface-mount device targets designs that require significant on-chip resources, high I/O density, and a compact BGA footprint. The device is RoHS compliant and operates from a supply range of 825 mV to 876 mV.

Key Features

• Core Architecture  Virtex® UltraScale+™ FPGA family device providing a large programmable fabric for complex logic implementations.
• Logic Capacity  2,851,800 logic elements to support high-density logic and compute tasks within a single device.
• Embedded Memory  Approximately 74.3 Mbits of on-chip RAM to support buffering, caching, and data-intensive processing.
• I/O  624 general-purpose I/O pins to enable wide external interfacing and parallel data paths.
• Power Supply  Nominal supply operating range from 825 mV to 876 mV, enabling compatibility with defined power architectures.
• Package & Mounting  2892-FCBGA (55×55) / 2892-BBGA package, surface-mount mounting type for compact board-level integration.
• Operating Temperature  Extended-grade rating with an operating range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• High-density digital processing  Use the device where very large logic capacity and on-chip memory are needed for complex algorithms and data pipelines.
• High-pin-count interfacing  Leverage 624 I/O pins for systems requiring wide parallel buses, multiple high-speed interfaces, or dense external connectivity.
• Memory‑intensive designs  Employ the approximately 74.3 Mbits of embedded memory for buffering, packet processing, or local data storage within FPGA logic.
• Compact system integration  Integrate into space-constrained boards using the 2892-FCBGA (55×55) surface-mount package while retaining high resource density.

Unique Advantages

• Large integrated logic capacity: 2,851,800 logic elements reduce the need for multiple devices, simplifying board design and lowering inter-device communication complexity.
• Substantial on-chip memory: Approximately 74.3 Mbits of embedded RAM supports local buffering and data processing without external memory dependence.
• High I/O density: 624 I/O pins enable broad external connectivity and flexible interface options on a single FPGA package.
• Compact, high-pin-count package: The 2892-FCBGA (55×55) footprint provides a balance of resource density and board-level integration for advanced systems.
• Extended-grade operation: Rated for 0 °C to 100 °C to meet a range of operating environments where extended temperature tolerance is required.
• Regulatory compliance: RoHS compliance supports environmentally responsible manufacturing and deployment.

Why Choose XCVU47P-1FSVH2892E?

The XCVU47P-1FSVH2892E positions itself as a high-capacity programmable logic device combining millions of logic elements, tens of megabits of embedded RAM, and a high I/O count in a single 2892‑pin FCBGA package. This combination supports complex, memory- and I/O‑intensive designs while enabling compact board integration and extended‑grade operation.

It is well suited for teams and projects that require substantial on-chip resources and a high-pin-count BGA form factor. The device’s specifications deliver scalability for advanced FPGA designs and help consolidate functionality onto a single, RoHS‑compliant device.

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