XCVU47P-2FSVH2892E
| Part Description |
Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 624 74344038 2851800 2892-BBGA, FCBGA |
|---|---|
| Quantity | 577 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2892-FCBGA (55x55) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2892-BBGA, FCBGA | Number of I/O | 624 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 162960 | Number of Logic Elements/Cells | 2851800 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 74344038 |
Overview of XCVU47P-2FSVH2892E – Virtex® UltraScale+™ FPGA, 624 I/Os, 2892-FCBGA
The XCVU47P-2FSVH2892E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 2892-FCBGA (55×55) package. It provides very large logic and embedded memory resources along with high I/O density for complex, programmable digital designs.
With 624 I/O pins, approximately 2,851,800 logic elements and about 74 Mbits of on-chip RAM, this extended-grade device targets designs that require significant logic capacity, substantial embedded memory, and dense board-level integration.
Key Features
- Architecture Virtex® UltraScale+™ FPGA family device providing a high-capacity programmable logic platform.
- Logic Capacity Approximately 2,851,800 logic elements and 162,960 logic blocks to implement large-scale digital functions and custom logic.
- Embedded Memory Approximately 74 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory dependence.
- I/O Density 624 I/O pins to support high-channel-count interfaces and dense board connectivity.
- Power Supply Core voltage supply range from 825 mV to 876 mV for defined power planning and supply design.
- Package and Mounting 2892-FCBGA (55×55) surface-mount package (also referenced as 2892-BBGA, FCBGA) for compact, high-pin-count PCB layouts.
- Operating Environment Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance for regulatory alignment.
Typical Applications
- High-density FPGA-based systems — Implement large-scale custom logic and control functions where extensive logic elements and on-chip RAM are required.
- Multi-channel I/O applications — Use the 624 I/O pins to interface with numerous peripherals, sensors, or high-speed I/O lanes on a single device.
- Embedded memory–centric designs — Leverage approximately 74 Mbits of embedded RAM for buffering, packet handling, and temporary data storage without immediate external memory needs.
Unique Advantages
- Substantial logic resources: Large logic element and logic block counts enable consolidation of complex functions into a single FPGA, reducing BOM and board complexity.
- Significant on-chip memory: Approximately 74 Mbits of embedded RAM supports buffering and stateful processing, lowering reliance on external memory components.
- High I/O count: 624 I/Os provide the routing capacity for multi-channel interfaces and dense connectivity on compact PCBs.
- Compact, high-pin package: 2892-FCBGA (55×55) format facilitates high pin density in a surface-mount footprint for advanced board designs.
- Extended-grade operation: 0 °C to 100 °C operating range and RoHS compliance support deployment in a variety of commercial and industrial environments.
Why Choose XCVU47P-2FSVH2892E?
The XCVU47P-2FSVH2892E positions itself as a high-capacity, high-connectivity FPGA option within the Virtex® UltraScale+™ family, combining millions of logic elements, tens of megabits of embedded RAM, and hundreds of I/Os in a single 2892-FCBGA package. Its extended-grade rating and defined voltage and temperature ranges allow engineering teams to plan power and thermal requirements with confidence.
This device is well suited for designs that demand large programmable logic fabrics and substantial on-chip memory while maintaining a compact board footprint—ideal for teams consolidating complex digital functions into a single, scalable device backed by AMD’s UltraScale+ product family.
Request a quote or submit an inquiry to receive pricing and availability for XCVU47P-2FSVH2892E. Our team can help you evaluate this device for your next high-capacity FPGA design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








