XCVU47P-3FSVH2892E

The XCVU47P-3FSVH2892E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC designed for high-density logic integration. It combines a large logic fabric with substantial on-chip memory and a high I/O count to support complex, I/O-intensive designs that require significant programmable resources.

Key hardware attributes include 2,851,800 logic elements, approximately 74 Mbits of embedded memory, 624 I/O pins, and a 2892-ball FCBGA package (55×55). The device is offered in an extended grade with an operating range of 0 °C to 100 °C and RoHS compliance.

Key Features

• Core Logic Capacity  2,851,800 logic elements provide a large programmable fabric for implementing extensive custom logic and complex algorithms.
• Embedded Memory  Approximately 74 Mbits of on-chip RAM enable local buffering, storage and memory-intensive logic functions.
• I/O Density  624 I/O pins support high channel counts and extensive external interfacing for multi-channel systems.
• Power Supply Range  Specified core voltage range of 825 mV to 876 mV to match platform power planning requirements.
• Package and Mounting  Available in a 2892-ball FCBGA (55×55) package; surface-mount mounting type suitable for compact PCB layouts.
• Operating Grade and Temperature  Extended grade device rated for operation from 0 °C to 100 °C, enabling deployment in a range of controlled-environment applications.
• Environmental Compliance  RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• High-density programmable logic systems  Use the large logic capacity and embedded memory to implement complex state machines, data processing pipelines, and algorithm accelerators.
• I/O‑intensive interfacing  Employ the 624 I/O pins for systems requiring many external connections, multi-channel interfaces, or extensive peripheral integration.
• Compact, high-pin-count board designs  The 2892-FCBGA (55×55) package enables dense board integration where high logic and I/O counts must fit a constrained PCB footprint.

Unique Advantages

• Massive programmable capacity: 2,851,800 logic elements enable implementation of large, integrated digital functions without partitioning across devices.
• Substantial on-chip memory: Approximately 74 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• High connectivity: 624 I/O pins support extensive external interfacing, simplifying board-level routing for multi-channel systems.
• Compact, high-density package: The 2892-FCBGA (55×55) package delivers high pin count in a compact footprint for space-constrained designs.
• Controlled-environment readiness: Extended grade operation from 0 °C to 100 °C aligns with typical controlled-environment applications and system requirements.
• RoHS compliant: Supports lead-free manufacturing processes and regulatory compliance needs.

Why Choose XCVU47P-3FSVH2892E?

The XCVU47P-3FSVH2892E positions itself as a high-density Virtex UltraScale+ FPGA option for designs that require a large programmable fabric, significant embedded memory, and a high I/O count in a compact FCBGA package. Its extended-grade rating and precise voltage specification make it appropriate for projects that demand predictable operating conditions and careful power planning.

This device is suited to engineering teams building advanced, I/O-heavy systems that benefit from tight integration of logic, memory, and connectivity. The combination of large logic resources, embedded RAM, and a high pin count provides long-term scalability for evolving designs while maintaining compliance with RoHS assembly requirements.

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