XCVU57P-3FSVK2892E

IC FPGA VIRTEX-UP 2892BGA
Part Description

Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 624 74344038 2851800 2892-BBGA, FCBGA

Quantity 647 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package2892-FCBGA (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2892-BBGA, FCBGANumber of I/O624Voltage873 mV - 927 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs162960Number of Logic Elements/Cells2851800
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits74344038

Overview of XCVU57P-3FSVK2892E – Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 624 74344038 2851800 2892-BBGA, FCBGA

The XCVU57P-3FSVK2892E is a Virtex® UltraScale+™ FPGA offering very high logic density and substantial on-chip memory in a 2892-ball FCBGA package. It combines a large programmable fabric with a high I/O count and a narrow core voltage range to address complex, high-capacity digital designs.

Targeted for designs that require extensive programmable logic, abundant embedded memory, and numerous I/Os, this extended-grade device supports operation across a 0 °C to 100 °C range and is RoHS compliant.

Key Features

  • Programmable Logic  2,851,800 logic elements to implement large-scale, custom digital architectures.
  • Embedded Memory  Approximately 74.34 Mbits of on-chip RAM for local buffering, state storage, and data structures.
  • I/O Capacity  624 user I/O pins to interface with multiple peripherals and high-density interconnects.
  • Power  Core voltage supply range of 873 mV to 927 mV for core power planning and regulator selection.
  • Package & Mounting  2892-ball FCBGA (2892-FCBGA, 55×55); surface-mount package suitable for high-pin-count board designs.
  • Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 2,851,800 logic elements enable implementation of complex, large-scale designs without immediate partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 74.34 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
  • Large I/O complement: 624 I/O pins support extensive peripheral connections and high-bandwidth interfaces.
  • Compact high-pin-count package: 2892-ball FCBGA (55×55) delivers high connectivity in a single, surface-mount footprint.
  • Predictable power planning: A defined core voltage window (873–927 mV) simplifies regulator selection and power sequencing.
  • Extended operating range: 0 °C to 100 °C grade for applications requiring broader commercial-environment robustness.

Why Choose XCVU57P-3FSVK2892E?

The XCVU57P-3FSVK2892E delivers a balance of very high logic capacity, large embedded memory resources, and a substantial I/O count within a single 2892-FCBGA package. Its extended-grade operating range and RoHS compliance make it suitable for demanding commercial and industrial-class applications that require dense programmable logic and significant on-chip storage.

As a member of the Virtex® UltraScale+™ family, this device is positioned for designs that need scalability in logic and memory while maintaining a compact, high-pin-count board footprint.

Request a quote or submit an inquiry today to discuss pricing, availability, and how the XCVU57P-3FSVK2892E can fit your next high-capacity FPGA design.

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