XCVU57P-1FSVK2892E

The XCVU57P-1FSVK2892E is an AMD Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC. This device provides substantial programmable logic capacity, embedded memory and a high I/O count in a 2892-ball FCBGA package.

Key device parameters include 2,851,800 logic elements, approximately 74.3 Mbits of embedded memory, 624 I/O pins, a supply voltage range of 825 mV to 876 mV, and an extended-grade operating range of 0 °C to 100 °C.

Key Features

• Core Logic  2,851,800 logic elements provide large programmable logic capacity for complex digital implementations.
• Embedded Memory  Approximately 74.3 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O Density  624 user I/O pins to enable high pin-count interfacing and broad signal connectivity.
• Package & Mounting  Supplied in a 2892-FCBGA (55×55) package intended for surface-mount assembly.
• Power  Specified supply voltage range of 825 mV to 876 mV for core power domains.
• Temperature & Grade  Extended grade device with an operating temperature range from 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for restricted substances.

Unique Advantages

• High programmable capacity: The large count of logic elements enables implementation of complex, large-scale digital designs without immediate partitioning.
• Substantial on-chip memory: Approximately 74.3 Mbits of embedded RAM reduces the need for external memory in many buffering and data-path applications.
• Extensive I/O availability: 624 I/O pins provide flexibility for dense board-level connectivity and multiple interface implementations.
• Compact, high-pin-count package: The 2892-FCBGA (55×55) offers a high pin count in a single compact surface-mount package for space-conscious board designs.
• Extended operating range: Extended-grade rating with 0 °C to 100 °C operation suits a wide set of commercial and embedded environments.
• Regulatory readiness: RoHS compliance supports environmental regulatory requirements for product manufacturing and distribution.

Why Choose XCVU57P-1FSVK2892E?

The XCVU57P-1FSVK2892E delivers a combination of high logic capacity, significant embedded memory and a large I/O count in a single 2892-ball FCBGA surface-mount package. Its electrical and thermal specifications—including a defined core supply range and extended-grade operating temperature—allow designers to plan system power and thermal solutions with precision.

This FPGA suits designs that require substantial on-chip resources and dense I/O in a compact package, while maintaining compliance with RoHS requirements. For teams focused on scalability and integration within AMD’s Virtex® UltraScale+™ family, this part provides verifiable, device-level specifications to guide system architecture and procurement decisions.

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