XCVU57P-L2FSVK2892E

The XCVU57P-L2FSVK2892E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC offering very high logic and I/O density in a 2892-ball FCBGA package. It provides 2,851,800 logic elements and approximately 74.3 Mbits of embedded memory for large-scale programmable logic implementations.

Designed for systems that require substantial on-chip resources and dense external connectivity, this surface-mount, extended-grade FPGA supports up to 624 I/O and operates from a core supply range of 698 mV to 742 mV with an operating temperature range of 0 °C to 110 °C.

Key Features

• Core Logic Capacity  2,851,800 logic elements for implementing complex programmable logic and wide parallelism.
• Embedded Memory  Approximately 74.3 Mbits of on-chip RAM to support large buffering, local data storage, and memory-intensive logic functions.
• I/O Density  624 I/O pins to support high-pin-count interfaces and extensive external connectivity.
• Package and Mounting  2892-FCBGA package (55×55 mm), surface-mount form factor for high pin-count, compact board designs.
• Power Supply  Core voltage supply range of 698 mV to 742 mV to match target system power rails.
• Operating Temperature and Grade  Extended grade with an operating range of 0 °C to 110 °C for applications requiring broader temperature tolerance.
• Compliance  RoHS compliant to meet environmental restrictions on hazardous substances.

Typical Applications

• High-density programmable logic systems  Implements large-scale logic designs that require millions of logic elements and substantial embedded memory.
• High I/O aggregation  Supports systems that consolidate many external interfaces or require extensive parallel connectivity via 624 I/O pins.
• Memory-intensive FPGA designs  Enables buffering, large lookup tables, and local data storage with approximately 74.3 Mbits of on-chip RAM.
• Compact, high-pin-count deployments  Fits board designs that need a high number of I/Os in a 2892-FCBGA (55×55) surface-mount package.

Unique Advantages

• Massive programmable resource pool: 2,851,800 logic elements let designers map large, complex functions directly onto silicon without external ASICs.
• Significant on-chip memory: Approximately 74.3 Mbits of embedded RAM reduces dependence on off-chip memory for latency-sensitive data paths.
• High connectivity: 624 I/O pins provide flexibility to interface with multiple high-pin-count peripherals and mezzanine modules.
• Compact high-density package: 2892-FCBGA (55×55) enables high-pin-count integration while minimizing PCB footprint.
• Extended operating range: 0 °C to 110 °C grade supports deployments that require a wider thermal tolerance.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCVU57P-L2FSVK2892E?

The XCVU57P-L2FSVK2892E positions itself as a high-capacity, high-connectivity FPGA suitable for designs that need very large logic and memory resources paired with extensive I/O. Its combination of 2,851,800 logic elements, approximately 74.3 Mbits of embedded RAM, and 624 I/O in a 2892-FCBGA package delivers a scalable hardware platform for demanding programmable tasks.

This extended-grade, surface-mount device is appropriate for engineers and procurement teams seeking a robust, high-density FPGA solution with clear electrical and thermal specifications, and RoHS environmental compliance for long-term deployment and manufacturing consistency.

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