XCVU5P-1FLVB2104I

The XCVU5P-1FLVB2104I is an AMD Virtex® UltraScale+™ field programmable gate array supplied in a 2104-FCBGA (47.5×47.5 mm) package and intended for surface-mount assembly. This industrial-grade FPGA integrates high logic density, substantial embedded RAM, and a large I/O count to support complex digital designs that require extensive on-chip resources.

Key measurable attributes include approximately 1,313,763 logic elements, approximately 191 Mbits of embedded memory, 702 I/O, an operating temperature range of −40 °C to 100 °C, and a core voltage supply range of 825 mV to 876 mV.

Key Features

• Core Logic  Approximately 1,313,763 logic elements provide a high-density programmable fabric for complex logic, computation, and control functions.
• Embedded Memory  Approximately 191 Mbits of total on-chip RAM bits enable large data buffering, on-chip storage, and memory-intensive processing without external memory reliance.
• I/O Capacity  702 user I/O pins support extensive peripheral interfacing and multi-channel connectivity within a single device.
• Power Supply  Core voltage supply range specified from 825 mV to 876 mV, suitable for designs targeting the device’s defined power envelope.
• Package & Mounting  Supplied in a 2104-BBGA / 2104-FCBGA package (47.5×47.5 mm) for surface-mount assembly, enabling compact board integration of high-density logic.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C to support deployments across a wide thermal range.
• RoHS Compliance  Device is RoHS compliant.

Unique Advantages

• High logic integration: The large count of logic elements consolidates complex systems into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Nearly 191 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data-processing tasks.
• Extensive I/O: 702 I/O pins provide flexibility for multi-channel interfaces, sensor arrays, or wide bus connections without additional I/O expanders.
• Industrial temperature range: Rated from −40 °C to 100 °C to support applications requiring extended thermal operation.
• Compact high-pin-count packaging: The 2104-FCBGA (47.5×47.5 mm) package delivers high connectivity and density in a surface-mount form factor.
• Defined core voltage window: Specified 825–876 mV supply range supports precise power design and stability considerations.

Why Choose XCVU5P-1FLVB2104I?

The XCVU5P-1FLVB2104I positions itself as a high-density, industrial-grade FPGA solution for designs that require large logic capacity, substantial embedded memory, and wide I/O capability in a single surface-mount package. Its specified operating temperature range and RoHS compliance make it suitable for systems that must meet industrial environmental and regulatory expectations.

This device is appropriate for engineering teams seeking a scalable programmable platform where on-chip resources reduce system complexity and external component count. The combination of logic density, embedded RAM, and a compact 2104-FCBGA package supports integration-heavy designs and long-term deployment across varied thermal conditions.

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